Inventor
IGUCHI MANABU
JP20 patents
⚠️ This page may combine multiple inventors who share the name “IGUCHI MANABU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
9 patentsUS6841880B2Jan 11, 2005
Semiconductor device and method of fabricating semiconductor device with high CMP uniformity and resistance to loss that occurs in dicing
NEC ELECTRONICS CORP294 citations98
US7138700B2Nov 21, 2006
Semiconductor device with guard ring for preventing water from entering circuit region from outside
NEC ELECTRONICS CORP26 citations92
US6876064B2Apr 5, 2005
Semiconductor device having superior resistance to moisture
NEC ELECTRONICS CORP36 citations92
US7019400B2Mar 28, 2006
Semiconductor device having multilayer interconnection structure and method for manufacturing the device
NEC ELECTRONICS CORP12 citations83
US6555911B1Apr 29, 2003
Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios
NEC ELECTRONICS CORP4 citations63
US7358609B2Apr 15, 2008
Semiconductor device
NEC ELECTRONICS CORP4 citations62
US6861759B2Mar 1, 2005
Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same
NEC ELECTRONICS CORP0 citations52
US7601640B2Oct 13, 2009
Method of manfacturing semiconductor device
NEC ELECTRONICS CORP0 citations49
US7052994B2May 30, 2006
Method for manufacturing semiconductor device, and processing system and semiconductor device
NEC ELECTRONICS CORP0 citations42
NEC CORP
5 patentsUS6225697B1May 1, 2001
Semiconductor device and method for manufacturing the same
NEC CORP69 citations95
US6379782B2Apr 30, 2002
Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same
NEC CORP21 citations92
US6376363B1Apr 23, 2002
Forming method of copper interconnection and semiconductor wafer with copper interconnection formed thereon
NEC CORP23 citations92
US6149730ANov 21, 2000
Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor
NEC CORP50 citations92
US6458690B2Oct 1, 2002
Method for manufacturing a multilayer interconnection structure
NEC CORP6 citations63