Inventor

TEWS DIRK

DE7 patents

⚠️ This page may combine multiple inventors who share the name “TEWS DIRK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ATOTECH DEUTSCHLAND GMBH

3 patents

US10477700B2Nov 12, 2019

Method for manufacturing a printed circuit board

ATOTECH DEUTSCHLAND GMBH1 citations53

US11963308B2Apr 16, 2024

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

ATOTECH DEUTSCHLAND GMBH0 citations41

US9441304B2Sep 13, 2016

Aqueous composition for etching of copper and copper alloys

ATOTECH DEUTSCHLAND GMBH0 citations32

TEWS DIRK

2 patents

US8192636B2Jun 5, 2012

Composition and method for improved adhesion of polymeric materials to copper alloy surfaces

TEWS DIRK3 citations54

US8758634B2Jun 24, 2014

Composition and method for micro etching of copper and copper alloys

TEWS DIRK0 citations41

SPARING CHRISTIAN

1 patent

US8945298B2Feb 3, 2015

Non-etching non-resist adhesion composition and method of preparing a work piece

SPARING CHRISTIAN1 citations38

WOOD NEAL

1 patent

US9332652B2May 3, 2016

Process for etching a recessed structure filled with tin or a tin alloy

WOOD NEAL0 citations29