Inventor
SAITOU MAKOTO
JP24 patents
⚠️ This page may combine multiple inventors who share the name “SAITOU MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAITOU MAKOTO
6 patentsUS8221877B2Jul 17, 2012
Foamed member, foamed member laminate, and electric or electronic device using foamed member
SAITOU MAKOTO6 citations81
US9150716B2Oct 6, 2015
Resin foam and foam sealing material
SAITOU MAKOTO4 citations69
US8211953B2Jul 3, 2012
Polyolefin resin foam and process for production thereof
SAITOU MAKOTO3 citations61
US11402793B2Aug 2, 2022
Rotating body, member to be inserted with shaft, retaining member, and apparatus
SAITOU MAKOTO0 citations60
US8715450B2May 6, 2014
Foamed member, foamed member laminate, and electric or electronic device using foamed member
SAITOU MAKOTO0 citations49
US8092962B2Jan 10, 2012
Image forming apparatus and image forming method
SAITOU MAKOTO0 citations40
MITSUBISHI ELECTRIC CORP
5 patentsUS7316120B2Jan 8, 2008
Refrigeration/air conditioning equipment
MITSUBISHI ELECTRIC CORP25 citations92
US7493775B2Feb 24, 2009
Air conditioner
MITSUBISHI ELECTRIC CORP27 citations90
US6997006B2Feb 14, 2006
Cooling device
MITSUBISHI ELECTRIC CORP61 citations90
USRE43998EFeb 19, 2013
Refrigeration/air conditioning equipment
MITSUBISHI ELECTRIC CORP5 citations83
US7984620B2Jul 26, 2011
Air conditioning apparatus
MITSUBISHI ELECTRIC CORP9 citations82
HITACHI CHEMICAL CO LTD
4 patentsUS6099678AAug 8, 2000
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
HITACHI CHEMICAL CO LTD61 citations94
US6825249B1Nov 30, 2004
Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
HITACHI CHEMICAL CO LTD17 citations82
US7241816B2Jul 10, 2007
Expandable styrene resin particles, expandable beads, and foamed article
HITACHI CHEMICAL CO LTD4 citations58
US6797733B2Sep 28, 2004
Expandable styrene resin particles, expandable beads, and foamed article
HITACHI CHEMICAL CO LTD2 citations58
UNEZAKI FUMITAKE
2 patentsUS8899058B2Dec 2, 2014
Air conditioner heat pump with injection circuit and automatic control thereof
UNEZAKI FUMITAKE9 citations82
US8109105B2Feb 7, 2012
Refrigerating air conditioning system, method of controlling operation of refrigerating air conditioning system, and method of controlling amount of refrigerant in refrigerating air conditioning system
UNEZAKI FUMITAKE18 citations80