Inventor
LIANG CHIN-WEI
US42 patents
⚠️ This page may combine multiple inventors who share the name “LIANG CHIN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
36 patentsUS10622555B2Apr 14, 2020
Film scheme to improve peeling in chalcogenide based PCRAM
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10193065B2Jan 29, 2019
High K scheme to improve retention performance of resistive random access memory (RRAM)
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9647207B2May 9, 2017
Resistive random access memory (RRAM) structure
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9484537B2Nov 1, 2016
Organic photo diode with dual electron blocking layers
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10818857B2Oct 27, 2020
Organic photosensitive device with an electron-blocking and hole-transport layer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10748967B2Aug 18, 2020
Image sensors with organic photodiodes and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10510587B2Dec 17, 2019
Method for manufacturing semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10350726B2Jul 16, 2019
Chemical mechanical polishing system and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9960353B2May 1, 2018
Method of fabricating an organic photodiode with dual electron blocking layers
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9876184B2Jan 23, 2018
Organic photosensitive device with an electron-blocking and hole-transport layer
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9425240B2Aug 23, 2016
Image sensors with organic photodiodes and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9219240B1Dec 22, 2015
Protective layer(s) in organic image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11887929B2Jan 30, 2024
Techniques to inhibit delamination from flowable gap-fill dielectric
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11495532B2Nov 8, 2022
Techniques to inhibit delamination from flowable gap-fill dielectric
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11049767B2Jun 29, 2021
Semiconductor device and methods of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11404484B2Aug 2, 2022
Image sensors with organic photodiodes and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12444607B2Oct 14, 2025
Apparatus and method for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12302663B2May 13, 2025
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266604B2Apr 1, 2025
Techniques to inhibit delamination from flowable gap-fill dielectric
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12113090B2Oct 8, 2024
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11869916B2Jan 9, 2024
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11348790B2May 31, 2022
Apparatus and method for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024800B2Jun 1, 2021
Film scheme to improve peeling in chalcogenide based PCRAM
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10967479B2Apr 6, 2021
Chemical mechanical polishing system and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10910260B2Feb 2, 2021
Method for manufacturing semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12456649B2Oct 28, 2025
Semiconductor device and methods of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12593732B2Mar 31, 2026
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11133231B2Sep 28, 2021
CMP apparatus and method for estimating film thickness
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10636661B2Apr 28, 2020
Apparatus and method for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10155214B2Dec 18, 2018
Getter, MEMS device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10115896B1Oct 30, 2018
Semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10008546B2Jun 26, 2018
Image sensors with organic photodiodes and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9637375B2May 2, 2017
MEMS device having a getter structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9567206B2Feb 14, 2017
Structures and formation methods of micro-electro mechanical system device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9543362B2Jan 10, 2017
Protective layer(s) in organic image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9725301B2Aug 8, 2017
Structures and formation methods of micro-electro mechanical system device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
ADVANCED MICRO DEVICES INC
5 patentsUS6701406B1Mar 2, 2004
PCI and MII compatible home phoneline networking alliance (HPNA) interface device
ADVANCED MICRO DEVICES INC119 citations97
US6947438B1Sep 20, 2005
PCI and MII compatible home phoneline networking alliance (HPNA) interface device
ADVANCED MICRO DEVICES INC21 citations92
US6912199B1Jun 28, 2005
Method to select transmission rate for network device
ADVANCED MICRO DEVICES INC9 citations74
US6697371B1Feb 24, 2004
Network switch with on-board management information based (MIB) counters
ADVANCED MICRO DEVICES INC8 citations66
US6853645B1Feb 8, 2005
PCI and MII compatible home phoneline networking alliance (HPNA) interface device
ADVANCED MICRO DEVICES INC3 citations62