P

Inventor

LIANG CHIN-WEI

US42 patents
⚠️ This page may combine multiple inventors who share the name “LIANG CHIN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

36 patents
US10622555B2Apr 14, 2020

Film scheme to improve peeling in chalcogenide based PCRAM

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10193065B2Jan 29, 2019

High K scheme to improve retention performance of resistive random access memory (RRAM)

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9647207B2May 9, 2017

Resistive random access memory (RRAM) structure

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9484537B2Nov 1, 2016

Organic photo diode with dual electron blocking layers

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10818857B2Oct 27, 2020

Organic photosensitive device with an electron-blocking and hole-transport layer

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10748967B2Aug 18, 2020

Image sensors with organic photodiodes and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10510587B2Dec 17, 2019

Method for manufacturing semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10350726B2Jul 16, 2019

Chemical mechanical polishing system and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9960353B2May 1, 2018

Method of fabricating an organic photodiode with dual electron blocking layers

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9876184B2Jan 23, 2018

Organic photosensitive device with an electron-blocking and hole-transport layer

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9425240B2Aug 23, 2016

Image sensors with organic photodiodes and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9219240B1Dec 22, 2015

Protective layer(s) in organic image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11887929B2Jan 30, 2024

Techniques to inhibit delamination from flowable gap-fill dielectric

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11495532B2Nov 8, 2022

Techniques to inhibit delamination from flowable gap-fill dielectric

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11049767B2Jun 29, 2021

Semiconductor device and methods of manufacturing thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11404484B2Aug 2, 2022

Image sensors with organic photodiodes and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12444607B2Oct 14, 2025

Apparatus and method for wafer bonding

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12302663B2May 13, 2025

Bond pad structure for bonding improvement

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266604B2Apr 1, 2025

Techniques to inhibit delamination from flowable gap-fill dielectric

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12113090B2Oct 8, 2024

Bond pad structure for bonding improvement

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11869916B2Jan 9, 2024

Bond pad structure for bonding improvement

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11348790B2May 31, 2022

Apparatus and method for wafer bonding

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024800B2Jun 1, 2021

Film scheme to improve peeling in chalcogenide based PCRAM

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10967479B2Apr 6, 2021

Chemical mechanical polishing system and method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10910260B2Feb 2, 2021

Method for manufacturing semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12456649B2Oct 28, 2025

Semiconductor device and methods of manufacturing thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12593732B2Mar 31, 2026

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11133231B2Sep 28, 2021

CMP apparatus and method for estimating film thickness

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10636661B2Apr 28, 2020

Apparatus and method for wafer bonding

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10155214B2Dec 18, 2018

Getter, MEMS device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10115896B1Oct 30, 2018

Semiconductor device and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10008546B2Jun 26, 2018

Image sensors with organic photodiodes and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9637375B2May 2, 2017

MEMS device having a getter structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9567206B2Feb 14, 2017

Structures and formation methods of micro-electro mechanical system device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9543362B2Jan 10, 2017

Protective layer(s) in organic image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9725301B2Aug 8, 2017

Structures and formation methods of micro-electro mechanical system device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42

ADVANCED MICRO DEVICES INC

5 patents

TAIWAN SEMICONDUCTOR MFG

1 patent