Inventor
CHEN SHIH-KUANG
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SHIH-KUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
7 patentsUS6229702B1May 8, 2001
Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability
ADVANCED SEMICONDUCTOR ENG123 citations97
US8035213B2Oct 11, 2011
Chip package structure and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG124 citations94
US6692581B2Feb 17, 2004
Solder paste for fabricating bump
ADVANCED SEMICONDUCTOR ENG18 citations92
US6737353B2May 18, 2004
Semiconductor device having bump electrodes
ADVANCED SEMICONDUCTOR ENG24 citations88
US7651937B2Jan 26, 2010
Bumping process and structure thereof
ADVANCED SEMICONDUCTOR ENG9 citations81
US6716736B2Apr 6, 2004
Method for manufacturing an under-bump metallurgy layer
ADVANCED SEMICONDUCTOR ENG7 citations72
US7518241B2Apr 14, 2009
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
ADVANCED SEMICONDUCTOR ENG7 citations69