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Inventor

LEE SUNGYOON

KR8 patents
⚠️ This page may combine multiple inventors who share the name “LEE SUNGYOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

4 patents
US7727875B2Jun 1, 2010

Grooving bumped wafer pre-underfill system

STATS CHIPPAC LTD21 citations92
US8030769B2Oct 4, 2011

Grooving bumped wafer pre-underfill system

STATS CHIPPAC LTD9 citations83
US7892072B2Feb 22, 2011

Method for directional grinding on backside of a semiconductor wafer

STATS CHIPPAC LTD7 citations81
US7838391B2Nov 23, 2010

Ultra thin bumped wafer with under-film

STATS CHIPPAC LTD2 citations62

SHIN JUNGHOON

2 patents
US8704366B2Apr 22, 2014

Ultra thin bumped wafer with under-film

SHIN JUNGHOON3 citations59
US8329554B2Dec 11, 2012

Ultra thin bumped wafer with under-film

SHIN JUNGHOON2 citations59

LIM TAEGKI

1 patent
US9136144B2Sep 15, 2015

Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation

LIM TAEGKI10 citations73

LEE SUNGYOON

1 patent
US8994196B2Mar 31, 2015

System and method for directional grinding on backside of a semiconductor wafer

LEE SUNGYOON0 citations42