Inventor

YOON BOHAN

KR4 patents

⚠️ This page may combine multiple inventors who share the name “YOON BOHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

3 patents

US7892072B2Feb 22, 2011

Method for directional grinding on backside of a semiconductor wafer

STATS CHIPPAC LTD7 citations81

US8035211B2Oct 11, 2011

Integrated circuit package system with support structure under wire-in-film adhesive

STATS CHIPPAC LTD12 citations79

US7659140B2Feb 9, 2010

Integrated circuit system with a debris trapping system

STATS CHIPPAC LTD2 citations61

LEE SUNGYOON

1 patent

US8994196B2Mar 31, 2015

System and method for directional grinding on backside of a semiconductor wafer

LEE SUNGYOON0 citations42