Inventor
HU KEVIN KUNZHONG
US17 patents
⚠️ This page may combine multiple inventors who share the name “HU KEVIN KUNZHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZHAO SAM ZIQUN
5 patentsUS8872321B2Oct 28, 2014
Semiconductor packages with integrated heat spreaders
ZHAO SAM ZIQUN9 citations84
US8749072B2Jun 10, 2014
Semiconductor package with integrated selectively conductive film interposer
ZHAO SAM ZIQUN7 citations84
US9275976B2Mar 1, 2016
System-in-package with integrated socket
ZHAO SAM ZIQUN3 citations73
US9153507B2Oct 6, 2015
Semiconductor package with improved testability
ZHAO SAM ZIQUN1 citations52
US9041171B2May 26, 2015
Programmable interposer with conductive particles
ZHAO SAM ZIQUN0 citations52
BROADCOM CORP
4 patentsUS9431371B2Aug 30, 2016
Semiconductor package with a bridge interposer
BROADCOM CORP20 citations90
US8922014B2Dec 30, 2014
Wafer level semiconductor package
BROADCOM CORP5 citations83
US9293393B2Mar 22, 2016
Stacked packaging using reconstituted wafers
BROADCOM CORP0 citations52
US8945991B2Feb 3, 2015
Fabricating a wafer level semiconductor package having a pre-formed dielectric layer
BROADCOM CORP0 citations51
KARIKALAN SAMPATH K V
3 patentsUS8928128B2Jan 6, 2015
Semiconductor package with integrated electromagnetic shielding
KARIKALAN SAMPATH K V37 citations93
US9059179B2Jun 16, 2015
Semiconductor package with a bridge interposer
KARIKALAN SAMPATH K V27 citations91
US9013041B2Apr 21, 2015
Semiconductor package with ultra-thin interposer without through-semiconductor vias
KARIKALAN SAMPATH K V7 citations83