Inventor

BAI JINCHAO

CN23 patents

⚠️ This page may combine multiple inventors who share the name “BAI JINCHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAI JINCHAO

BOE TECHNOLOGY GROUP CO LTD

Substrate and manufacturing method thereof, and display device

Touch display panel having a plurality of spacers connected to a thin film transistor and manufacturing method thereof

Dual-gate thin film transistor, manufacturing method thereof, array substrate and display device

Array substrate with thin film transistor and method of manufacturing the same

Array substrate and manufacturing method thereof, display panel and display device

Array substrate and manufacturing method thereof, and display device

Array substrate and fabrication method thereof, optical touch screen, and display device

Array substrate, its manufacturing method, and display device

Method for manufacturing fan-out lines on array substrate

Dry etching method

Array substrate and testing method and manufacturing method thereof

Array substrate, method for manufacturing the same and display apparatus

Array substrate, method for manufacturing the same and display apparatus

Array substrate, method for manufacturing the same and display apparatus

Method for manufacturing an array substrate motherboard

Thin film transistor, array substrate, and display apparatus, and fabrication methods thereof

Detection system for detecting service life of baffle mechanism in a chamber for vacuum coating

Array substrate, manufacturing method for the same, display device and electronic product

Thin-film transistor (TFT) and manufacturing method thereof, array substrate and manufacturing method thereof, and display device

BEIJING BOE DISPLAY TECH CO

Display panel, array substrate and method for preparing same

Flexible temperature sensor, method for preparing the same and flexible device

Thin film transistor and method for manufacturing the same, array substrate, and display device

Method for preparing array substrate by stripping first photo-resist layer through wet etching before forming ohm contact layer and active layer