Inventor
DIEP BUU Q
US13 patents
⚠️ This page may combine multiple inventors who share the name “DIEP BUU Q”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
12 patentsUS9093444B2Jul 28, 2015
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO4 citations83
US9227839B2Jan 5, 2016
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
RAYTHEON CO2 citations62
US9132496B2Sep 15, 2015
Reducing formation of oxide on solder
RAYTHEON CO2 citations62
US9334154B2May 10, 2016
Hermetically sealed package having stress reducing layer
RAYTHEON CO2 citations60
US10315918B2Jun 11, 2019
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO0 citations51
US10262913B2Apr 16, 2019
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9966320B2May 8, 2018
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9520332B2Dec 13, 2016
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9427776B2Aug 30, 2016
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO1 citations51
US9969610B2May 15, 2018
Wafer level MEMS package including dual seal ring
RAYTHEON CO1 citations50
US9771258B2Sep 26, 2017
Wafer level MEMS package including dual seal ring
RAYTHEON CO0 citations50
US9708181B2Jul 18, 2017
Hermetically sealed package having stress reducing layer
RAYTHEON CO0 citations49