Inventor
KOCIAN THOMAS A
US16 patents
⚠️ This page may combine multiple inventors who share the name “KOCIAN THOMAS A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
7 patentsUS9227839B2Jan 5, 2016
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
RAYTHEON CO2 citations62
US9132496B2Sep 15, 2015
Reducing formation of oxide on solder
RAYTHEON CO2 citations62
US10315918B2Jun 11, 2019
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO0 citations51
US10262913B2Apr 16, 2019
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9966320B2May 8, 2018
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9520332B2Dec 13, 2016
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9427776B2Aug 30, 2016
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO1 citations51
TEXAS INSTRUMENTS INC
5 patentsUS6762868B2Jul 13, 2004
Electro-optical package with drop-in aperture
TEXAS INSTRUMENTS INC61 citations95
US5550398AAug 27, 1996
Hermetic packaging with optical
TEXAS INSTRUMENTS INC74 citations90
US7466018B2Dec 16, 2008
MEMS device wafer-level package
TEXAS INSTRUMENTS INC9 citations83
US7226810B2Jun 5, 2007
MEMS device wafer-level package
TEXAS INSTRUMENTS INC9 citations73
US6908791B2Jun 21, 2005
MEMS device wafer-level package
TEXAS INSTRUMENTS INC5 citations73