Inventor
STARKSTON ROBERT
US32 patents
⚠️ This page may combine multiple inventors who share the name “STARKSTON ROBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
29 patentsUS9269701B2Feb 23, 2016
Localized high density substrate routing
INTEL CORP49 citations98
US6617683B2Sep 9, 2003
Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
INTEL CORP99 citations96
US6191475B1Feb 20, 2001
Substrate for reducing electromagnetic interference and enclosure
INTEL CORP114 citations95
US9679843B2Jun 13, 2017
Localized high density substrate routing
INTEL CORP17 citations92
US7015592B2Mar 21, 2006
Marking on underfill
INTEL CORP18 citations92
US6043983AMar 28, 2000
EMI containment for microprocessor core mounted on a card using surface mounted clips
INTEL CORP47 citations92
US10366951B2Jul 30, 2019
Localized high density substrate routing
INTEL CORP7 citations84
US7332423B2Feb 19, 2008
Soldering a die to a substrate
INTEL CORP14 citations81
US7223638B2May 29, 2007
Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
INTEL CORP9 citations74
US11515248B2Nov 29, 2022
Localized high density substrate routing
INTEL CORP2 citations73
US9832860B2Nov 28, 2017
Panel level fabrication of package substrates with integrated stiffeners
INTEL CORP4 citations72
US6043560AMar 28, 2000
Thermal interface thickness control for a microprocessor
INTEL CORP11 citations72
US7772090B2Aug 10, 2010
Methods for laser scribing wafers
INTEL CORP7 citations71
US11923257B2Mar 5, 2024
Hybrid microelectronic substrates
INTEL CORP2 citations70
US11114353B2Sep 7, 2021
Hybrid microelectronic substrates
INTEL CORP2 citations70
US6239973B1May 29, 2001
EMI containment for microprocessor core mounted on a card using surface mounted clips
INTEL CORP12 citations70
US10008452B2Jun 26, 2018
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
INTEL CORP1 citations63
US9001520B2Apr 7, 2015
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
INTEL CORP3 citations63
US12107042B2Oct 1, 2024
Localized high density substrate routing
INTEL CORP0 citations62
US11984396B2May 14, 2024
Localized high density substrate routing
INTEL CORP0 citations62
US11444033B2Sep 13, 2022
Hybrid microelectronic substrate and methods for fabricating the same
INTEL CORP0 citations60
US8364304B2Jan 29, 2013
Methods and apparatus for laser scribing wafers
INTEL CORP4 citations60
US11022792B2Jun 1, 2021
Coupling a magnet with a MEMS device
INTEL CORP0 citations59
US10796988B2Oct 6, 2020
Localized high density substrate routing
INTEL CORP0 citations52
US9642248B2May 2, 2017
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
INTEL CORP0 citations52
US10763215B2Sep 1, 2020
Hybrid microelectronic substrate and methods for fabricating the same
INTEL CORP0 citations50
US10125013B2Nov 13, 2018
Microelectromechanical system with spring for magnet placement
INTEL CORP0 citations47
US10716214B2Jul 14, 2020
Hybrid microelectronic substrate and methods for fabricating the same
INTEL CORP0 citations39
US10304769B2May 28, 2019
Multi-die package
INTEL CORP0 citations36