P

Inventor

SU YU-CHUNG

TW23 patents
⚠️ This page may combine multiple inventors who share the name “SU YU-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

18 patents
US9812358B1Nov 7, 2017

FinFET structures and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations83
US9436086B2Sep 6, 2016

Anti-reflective layer and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US9281192B2Mar 8, 2016

CMP-friendly coatings for planar recessing or removing of variable-height layers

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11120995B2Sep 14, 2021

Method for forming multi-layer mask

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10755927B2Aug 25, 2020

Anti-reflective gap filling materials and methods

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10082734B2Sep 25, 2018

Composition and method for lithography patterning

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11094541B2Aug 17, 2021

Anti-reflective coating materials

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10768527B2Sep 8, 2020

Resist solvents for photolithography applications

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12547075B2Feb 10, 2026

Method of forming photoresist pattern

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10770293B2Sep 8, 2020

Method for manufacturing a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10497574B2Dec 3, 2019

Method for forming multi-layer mask

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163631B2Dec 25, 2018

Polymer resin comprising gap filling materials and methods

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9761449B2Sep 12, 2017

Gap filling materials and methods

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12578640B2Mar 17, 2026

Photosensitive material for photoresist and lithography

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12087616B2Sep 10, 2024

Air gap formation method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10515953B2Dec 24, 2019

Method and structure for gap filling improvement

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9793268B2Oct 17, 2017

Method and structure for gap filling improvement

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US12535739B2Jan 27, 2026

Method of forming photoresist pattern

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

TAIWAN SEMICONDUCTOR MFG

3 patents

HON HAI PREC IND CO LTD

2 patents