Inventor
SCHROCK EDWARD
US5 patents
Patents
5 patentsUS6048755AApr 11, 2000
Method for fabricating BGA package using substrate with patterned solder mask open in die attach area
MICRON TECHNOLOGY INC473 citations98
US6825569B2Nov 30, 2004
BGA package having substrate with patterned solder mask defining open die attach area
MICRON TECHNOLOGY INC44 citations95
US6710456B1Mar 23, 2004
Composite interposer for BGA packages
MICRON TECHNOLOGY INC51 citations95
US6770981B2Aug 3, 2004
Composite interposer for BGA packages
MICRON TECHNOLOGY INC11 citations73
US7071030B2Jul 4, 2006
Method of making a flexible substrate with a filler material
MICRON TECHNOLOGY INC3 citations62