Inventor

LAMBERT WILLIAM J

US51 patents

⚠️ This page may combine multiple inventors who share the name “LAMBERT WILLIAM J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAMBERT WILLIAM J

INTEL CORP

Techniques and configurations associated with a capductor assembly

Helical plated through-hole package inductor

Apparatus and method to reduce power losses in an integrated voltage regulator

Conformal power delivery structure for direct chip attach architectures

Antenna package using ball attach array to connect antenna and base substrates

Method of making an inductor

Edge-firing antenna walls built into substrate

Hybrid pitch package with ultra high density interconnect capability

Hybrid pitch package with ultra high density interconnect capability

Power delivery through capacitor-dies in a multi-layered microelectronic assembly

5G mmWave cooling through PCB

Magnetic small footprint inductor array module for on-package voltage regulator

Magnetic small footprint inductor array module for on-package voltage regulator

Radio frequency front-end structures

Antenna package using ball attach array to connect antenna and base substrates

Microelectronic assemblies with direct attach to circuit boards

High-throughput additively manufactured power delivery vias and traces

Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations

Multi-phase switching regulators with hybrid inductors and per phase frequency control

High performance integrated RF passives using dual lithography process

Antenna package using ball attach array to connect antenna and base substrates

Thermals for packages with inductors

5G mmWave antenna architecture with thermal management

Helical plated through-hole package inductor

Thermals for packages with inductors

High performance integrated RF passives using dual lithography process

High density interconnection of microelectronic devices

Wirebond and leadframe magnetic inductors

Apparatus and method to reduce power losses in an integrated voltage regulator

Antenna modules and communication devices

Antenna modules and communication devices

Magnetic core inductors in interposer

Radio frequency front-end structures

Package embedded magnetic power transformers for SMPS

Package architecture for quasi-monolithic chip with backside power

In situ inductor structure in buildup power planes

Packaging architecture for disaggregated integrated voltage regulators

Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures

High density interconnection of microelectronic devices

Reconfigurable inductor

Component stiffener architectures for microelectronic package structures

Magnetic small footprint inductor array module for on-package voltage regulator

Package architecture for antenna arrays

SCIOS INC

Prolonged delivery of peptides

Prolonged delivery of peptides

EISAI CO LTD

System and method for measuring freeze dried cake resistance

AYYANAR RAJAPANDIAN

Transient voltage compensation system and method

IPL SYSTEMS INC

System for controlling data flow

CHIU CHIA-PIN

Die assembly on thin dielectric sheet

SK HYNIX NAND PRODUCT SOLUTIONS CORP

Keep out zone with hydrophobic surface for integrated circuit (IC) package