Inventor
WOJEWODA LEIGH E
US5 patents
Patents
5 patentsUS6614122B1Sep 2, 2003
Controlling underfill flow locations on high density packages using physical trenches and dams
INTEL CORP86 citations94
US11437346B2Sep 6, 2022
Package structure having substrate thermal vent structures for inductor cooling
INTEL CORP6 citations71
US10340260B2Jul 2, 2019
Magnetic small footprint inductor array module for on-package voltage regulator
INTEL CORP1 citations69
US9911723B2Mar 6, 2018
Magnetic small footprint inductor array module for on-package voltage regulator
INTEL CORP3 citations69
US10741536B2Aug 11, 2020
Magnetic small footprint inductor array module for on-package voltage regulator
INTEL CORP0 citations48