P

Inventor

CHENG SHIH-LIAN

TW25 patents
⚠️ This page may combine multiple inventors who share the name “CHENG SHIH-LIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIMICRON TECHNOLOGY CORP

20 patents
US9161454B2Oct 13, 2015

Electrical device package structure and method of fabricating the same

UNIMICRON TECHNOLOGY CORP8 citations84
US10999935B2May 4, 2021

Manufacturing method of circuit board

UNIMICRON TECHNOLOGY CORP0 citations62
US12052815B2Jul 30, 2024

Manufacturing method of circuit board

UNIMICRON TECHNOLOGY CORP0 citations59
US11785707B2Oct 10, 2023

Circuit board and manufacturing method thereof and electronic device

UNIMICRON TECHNOLOGY CORP0 citations59
US11686008B2Jun 27, 2023

Electroplating apparatus and electroplating method

UNIMICRON TECHNOLOGY CORP0 citations58
US11366381B2Jun 21, 2022

Mask structure and manufacturing method thereof

UNIMICRON TECHNOLOGY CORP0 citations58
US10271433B2Apr 23, 2019

Method of fabricating an electrical device package structure

UNIMICRON TECHNOLOGY CORP0 citations52
US8955218B2Feb 17, 2015

Method for fabricating package substrate

UNIMICRON TECHNOLOGY CORP0 citations52
US11910535B2Feb 20, 2024

Printed circuit board stack structure and manufacturing method thereof

UNIMICRON TECHNOLOGY CORP0 citations51
US11895773B2Feb 6, 2024

Circuit board structure

UNIMICRON TECHNOLOGY CORP0 citations51
US11818833B2Nov 14, 2023

Circuit board structure

UNIMICRON TECHNOLOGY CORP0 citations51
US11737206B2Aug 22, 2023

Circuit board structure

UNIMICRON TECHNOLOGY CORP0 citations51
US10813223B2Oct 20, 2020

Piezochromic stamp

UNIMICRON TECHNOLOGY CORP0 citations51
US10512166B2Dec 17, 2019

Manufacturing method of circuit board and stamp

UNIMICRON TECHNOLOGY CORP0 citations51
US10426038B2Sep 24, 2019

Manufacturing method of circuit board

UNIMICRON TECHNOLOGY CORP0 citations51
US10362682B2Jul 23, 2019

Manufacturing method of circuit board

UNIMICRON TECHNOLOGY CORP0 citations51
US10098234B2Oct 9, 2018

Manufacturing method of circuit board

UNIMICRON TECHNOLOGY CORP0 citations51
US12057381B2Aug 6, 2024

Circuit board having laminated build-up layers

UNIMICRON TECHNOLOGY CORP0 citations47
US11859302B2Jan 2, 2024

Electroplating apparatus and electroplating method

UNIMICRON TECHNOLOGY CORP0 citations47
US10324370B2Jun 18, 2019

Manufacturing method of circuit substrate and mask structure and manufacturing method thereof

UNIMICRON TECHNOLOGY CORP0 citations47

SUBTRON TECHNOLOGY CO LTD

2 patents

CHEN TSUNG-YUAN

1 patent

SABTRON TECHNOLOGY CO LTD

1 patent

UNIMICRON TECH CORPORATION

1 patent