Inventor
CHENG SHIH-LIAN
TW25 patents
⚠️ This page may combine multiple inventors who share the name “CHENG SHIH-LIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
20 patentsUS9161454B2Oct 13, 2015
Electrical device package structure and method of fabricating the same
UNIMICRON TECHNOLOGY CORP8 citations84
US10999935B2May 4, 2021
Manufacturing method of circuit board
UNIMICRON TECHNOLOGY CORP0 citations62
US12052815B2Jul 30, 2024
Manufacturing method of circuit board
UNIMICRON TECHNOLOGY CORP0 citations59
US11785707B2Oct 10, 2023
Circuit board and manufacturing method thereof and electronic device
UNIMICRON TECHNOLOGY CORP0 citations59
US11686008B2Jun 27, 2023
Electroplating apparatus and electroplating method
UNIMICRON TECHNOLOGY CORP0 citations58
US11366381B2Jun 21, 2022
Mask structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations58
US10271433B2Apr 23, 2019
Method of fabricating an electrical device package structure
UNIMICRON TECHNOLOGY CORP0 citations52
US8955218B2Feb 17, 2015
Method for fabricating package substrate
UNIMICRON TECHNOLOGY CORP0 citations52
US11910535B2Feb 20, 2024
Printed circuit board stack structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US11895773B2Feb 6, 2024
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations51
US11818833B2Nov 14, 2023
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations51
US11737206B2Aug 22, 2023
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations51
US10813223B2Oct 20, 2020
Piezochromic stamp
UNIMICRON TECHNOLOGY CORP0 citations51
US10512166B2Dec 17, 2019
Manufacturing method of circuit board and stamp
UNIMICRON TECHNOLOGY CORP0 citations51
US10426038B2Sep 24, 2019
Manufacturing method of circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
US10362682B2Jul 23, 2019
Manufacturing method of circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
US10098234B2Oct 9, 2018
Manufacturing method of circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
US12057381B2Aug 6, 2024
Circuit board having laminated build-up layers
UNIMICRON TECHNOLOGY CORP0 citations47
US11859302B2Jan 2, 2024
Electroplating apparatus and electroplating method
UNIMICRON TECHNOLOGY CORP0 citations47
US10324370B2Jun 18, 2019
Manufacturing method of circuit substrate and mask structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations47