P

Inventor

CHIBVONGODZE HARDWELL

JP24 patents
⚠️ This page may combine multiple inventors who share the name “CHIBVONGODZE HARDWELL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK TECHNOLOGIES LLC

20 patents
US10741535B1Aug 11, 2020

Bonded assembly containing multiple memory dies sharing peripheral circuitry on a support die and methods for making the same

SANDISK TECHNOLOGIES LLC20 citations94
US10629675B1Apr 21, 2020

Three-dimensional memory device containing capacitor pillars and methods of making the same

SANDISK TECHNOLOGIES LLC35 citations94
US11069410B1Jul 20, 2021

Three-dimensional NOR-NAND combination memory device and method of making the same

SANDISK TECHNOLOGIES LLC26 citations93
US11335671B2May 17, 2022

Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same

SANDISK TECHNOLOGIES LLC8 citations85
US10971231B1Apr 6, 2021

Adaptive VPASS for 3D flash memory with pair string structure

SANDISK TECHNOLOGIES LLC8 citations83
US10854619B2Dec 1, 2020

Three-dimensional memory device containing bit line switches

SANDISK TECHNOLOGIES LLC9 citations83
US10734080B2Aug 4, 2020

Three-dimensional memory device containing bit line switches

SANDISK TECHNOLOGIES LLC9 citations83
US11222954B2Jan 11, 2022

Three-dimensional memory device containing inter-select-gate electrodes and methods of making the same

SANDISK TECHNOLOGIES LLC2 citations73
US11081185B2Aug 3, 2021

Non-volatile memory array driven from both sides for performance improvement

SANDISK TECHNOLOGIES LLC6 citations73
US11024385B2Jun 1, 2021

Parallel memory operations in multi-bonded memory device

SANDISK TECHNOLOGIES LLC4 citations73
US10878907B1Dec 29, 2020

Sub-block size reduction for 3D non-volatile memory

SANDISK TECHNOLOGIES LLC4 citations73
US10839918B1Nov 17, 2020

Boost converter in memory chip

SANDISK TECHNOLOGIES LLC3 citations73
US10622367B1Apr 14, 2020

Three-dimensional memory device including three-dimensional bit line discharge transistors and method of making the same

SANDISK TECHNOLOGIES LLC3 citations73
US11889694B2Jan 30, 2024

Three-dimensional memory device with separated contact regions and methods for forming the same

SANDISK TECHNOLOGIES LLC2 citations72
US11361816B2Jun 14, 2022

Memory block with separately driven source regions to improve performance

SANDISK TECHNOLOGIES LLC2 citations72
US10978152B1Apr 13, 2021

Adaptive VPASS for 3D flash memory with pair string structure

SANDISK TECHNOLOGIES LLC3 citations72
US11487454B2Nov 1, 2022

Systems and methods for defining memory sub-blocks

SANDISK TECHNOLOGIES LLC1 citations62
US11404122B2Aug 2, 2022

Sub-block size reduction for 3D non-volatile memory

SANDISK TECHNOLOGIES LLC1 citations62
US11189335B2Nov 30, 2021

Double write/read throughput by CMOS adjacent array (CaA) NAND memory

SANDISK TECHNOLOGIES LLC0 citations62
US12284807B2Apr 22, 2025

Three-dimensional memory device with separated contact regions

SANDISK TECHNOLOGIES LLC0 citations51

SANDISK TECHNOLOGIES INC

2 patents

SANDISK CORP

1 patent

WESTERN DIGITAL TECH INC

1 patent