Inventor
CHIBVONGODZE HARDWELL
JP24 patents
⚠️ This page may combine multiple inventors who share the name “CHIBVONGODZE HARDWELL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK TECHNOLOGIES LLC
20 patentsUS10741535B1Aug 11, 2020
Bonded assembly containing multiple memory dies sharing peripheral circuitry on a support die and methods for making the same
SANDISK TECHNOLOGIES LLC20 citations94
US10629675B1Apr 21, 2020
Three-dimensional memory device containing capacitor pillars and methods of making the same
SANDISK TECHNOLOGIES LLC35 citations94
US11069410B1Jul 20, 2021
Three-dimensional NOR-NAND combination memory device and method of making the same
SANDISK TECHNOLOGIES LLC26 citations93
US11335671B2May 17, 2022
Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same
SANDISK TECHNOLOGIES LLC8 citations85
US10971231B1Apr 6, 2021
Adaptive VPASS for 3D flash memory with pair string structure
SANDISK TECHNOLOGIES LLC8 citations83
US10854619B2Dec 1, 2020
Three-dimensional memory device containing bit line switches
SANDISK TECHNOLOGIES LLC9 citations83
US10734080B2Aug 4, 2020
Three-dimensional memory device containing bit line switches
SANDISK TECHNOLOGIES LLC9 citations83
US11222954B2Jan 11, 2022
Three-dimensional memory device containing inter-select-gate electrodes and methods of making the same
SANDISK TECHNOLOGIES LLC2 citations73
US11081185B2Aug 3, 2021
Non-volatile memory array driven from both sides for performance improvement
SANDISK TECHNOLOGIES LLC6 citations73
US11024385B2Jun 1, 2021
Parallel memory operations in multi-bonded memory device
SANDISK TECHNOLOGIES LLC4 citations73
US10878907B1Dec 29, 2020
Sub-block size reduction for 3D non-volatile memory
SANDISK TECHNOLOGIES LLC4 citations73
US10839918B1Nov 17, 2020
Boost converter in memory chip
SANDISK TECHNOLOGIES LLC3 citations73
US10622367B1Apr 14, 2020
Three-dimensional memory device including three-dimensional bit line discharge transistors and method of making the same
SANDISK TECHNOLOGIES LLC3 citations73
US11889694B2Jan 30, 2024
Three-dimensional memory device with separated contact regions and methods for forming the same
SANDISK TECHNOLOGIES LLC2 citations72
US11361816B2Jun 14, 2022
Memory block with separately driven source regions to improve performance
SANDISK TECHNOLOGIES LLC2 citations72
US10978152B1Apr 13, 2021
Adaptive VPASS for 3D flash memory with pair string structure
SANDISK TECHNOLOGIES LLC3 citations72
US11487454B2Nov 1, 2022
Systems and methods for defining memory sub-blocks
SANDISK TECHNOLOGIES LLC1 citations62
US11404122B2Aug 2, 2022
Sub-block size reduction for 3D non-volatile memory
SANDISK TECHNOLOGIES LLC1 citations62
US11189335B2Nov 30, 2021
Double write/read throughput by CMOS adjacent array (CaA) NAND memory
SANDISK TECHNOLOGIES LLC0 citations62
US12284807B2Apr 22, 2025
Three-dimensional memory device with separated contact regions
SANDISK TECHNOLOGIES LLC0 citations51