Inventor
MILLA JUAN G
US9 patents
Patents
9 patentsUS6991961B2Jan 31, 2006
Method of forming a high-voltage/high-power die package
MEDTRONIC INC88 citations96
US6057175AMay 2, 2000
Method of making encapsulated package
MEDTRONIC INC57 citations95
US5674258AOct 7, 1997
Packaged integrated accelerometer
MEDTRONIC INC109 citations94
US6963780B2Nov 8, 2005
Implantable medical device including a surface-mount terminal array
MEDTRONIC INC67 citations92
US6836022B2Dec 28, 2004
High voltage flip-chip component package and method for forming the same
MEDTRONIC INC12 citations73
US6670217B2Dec 30, 2003
Methods for forming a die package
MEDTRONIC INC10 citations73
US7045390B2May 16, 2006
Stacked die package
MEDTRONIC INC5 citations72
US6696318B2Feb 24, 2004
Methods for forming a die package
MEDTRONIC INC9 citations72
US6626931B2Sep 30, 2003
Implantable medical electronics using high voltage flip chip components
MEDTRONIC INC5 citations62