Inventor
CHIN CHIA CHENG
US9 patents
Patents
9 patentsUS10854511B2Dec 1, 2020
Methods of lowering wordline resistance
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US10468263B2Nov 5, 2019
Tungsten deposition without barrier layer
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Nucleation-free gap fill ALD process
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US11289374B2Mar 29, 2022
Nucleation-free gap fill ALD process
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US12334341B2Jun 17, 2025
Chamber body feedthrough for in chamber resistive heating element
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US11948796B2Apr 2, 2024
Selective methods for fabricating devices and structures
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US10854461B2Dec 1, 2020
Tungsten deposition without barrier layer
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US12593643B2Mar 31, 2026
Batch thermal process chamber
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US12428731B2Sep 30, 2025
Flow guide structures and heat shield structures, and related methods, for deposition uniformity and process adjustability
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