Inventor
YANO GENKI
JP14 patents
Patents
14 patentsUS9896330B2Feb 20, 2018
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC12 citations90
US10658240B1May 19, 2020
Semiconductor die singulation
TEXAS INSTRUMENTS INC12 citations84
US10233074B2Mar 19, 2019
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC4 citations82
US9230862B2Jan 5, 2016
Wafer die separation
TEXAS INSTRUMENTS INC11 citations82
US11498831B2Nov 15, 2022
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC1 citations71
US10723616B2Jul 28, 2020
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC2 citations71
US9543206B2Jan 10, 2017
Wafer die separation
TEXAS INSTRUMENTS INC2 citations71
US11367699B2Jun 21, 2022
Integrated circuit backside metallization
TEXAS INSTRUMENTS INC0 citations62
US10763230B2Sep 1, 2020
Integrated circuit backside metallization
TEXAS INSTRUMENTS INC1 citations62
US11664276B2May 30, 2023
Front side laser-based wafer dicing
TEXAS INSTRUMENTS INC0 citations59
US11171031B2Nov 9, 2021
Die matrix expander with partitioned subring
TEXAS INSTRUMENTS INC1 citations59
US12198982B2Jan 14, 2025
Laser dicing for singulation
TEXAS INSTRUMENTS INC0 citations58
US11482442B2Oct 25, 2022
Subring for semiconductor dies
TEXAS INSTRUMENTS INC0 citations58
US11469141B2Oct 11, 2022
Laser dicing for singulation
TEXAS INSTRUMENTS INC0 citations58