Inventor

LIN CHU-FU

TW19 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHU-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHU-FU

UNITED MICROELECTRONICS CORP

Substrate with integrated passive devices and method of manufacturing the same

Chip with through silicon via electrode and method of forming the same

Semiconductor package structure and method for forming the same

Semiconductor structure

Semiconductor package structure

Anti-fuse structure and programming method thereof

Capacitor structure and method for manufacturing the same

Capacitor structure and method for manufacturing the same

Method for manufacturing capacitor structure

Capacitor structure and method for manufacturing the same

Semiconductor structure

Semiconductor package structure and method for forming the same

Method of forming chip with through silicon via electrode

Fan-out wafer level package

Through-silicon via structure

MEGICA CORP

Chip structure with bumps and testing pads

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Chip structure with bumps and testing pads

CHOU CHIEN-KANG

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer