Inventor
MILLER GALEN W
US10 patents
Patents
10 patentsUS10681814B2Jun 9, 2020
High density multi-component packages
KEMET ELECTRONICS CORP3 citations72
US9805872B2Oct 31, 2017
Multiple MLCC modules
KEMET ELECTRONICS CORP5 citations72
US10381162B2Aug 13, 2019
Leadless stack comprising multiple components
KEMET ELECTRONICS CORP5 citations71
US10984955B2Apr 20, 2021
Electronic component structures with reduced microphonic noise
KEMET ELECTRONICS CORP1 citations62
US10366836B2Jul 30, 2019
Electronic component structures with reduced microphonic noise
KEMET ELECTRONICS CORP1 citations62
US11923151B2Mar 5, 2024
Structural lead frame
KEMET ELECTRONICS CORP0 citations61
US11744018B2Aug 29, 2023
Component assemblies and embedding for high density electronics
KEMET ELECTRONICS CORP0 citations56
US10790094B2Sep 29, 2020
Method of forming a leadless stack comprising multiple components
KEMET ELECTRONICS CORP0 citations50
US10757811B2Aug 25, 2020
Higher density multi-component and serial packages
KEMET ELECTRONICS CORP0 citations48
US10224149B2Mar 5, 2019
Bulk MLCC capacitor module
KEMET ELECTRONICS CORP0 citations41