Inventor
LAI FENGYUAN
US9 patents
⚠️ This page may combine multiple inventors who share the name “LAI FENGYUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
7 patentsUS9837270B1Dec 5, 2017
Densification of silicon carbide film using remote plasma treatment
LAM RES CORP62 citations97
US10297442B2May 21, 2019
Remote plasma based deposition of graded or multi-layered silicon carbide film
LAM RES CORP22 citations93
US10760158B2Sep 1, 2020
Ex situ coating of chamber components for semiconductor processing
LAM RES CORP14 citations92
US11365479B2Jun 21, 2022
Ex situ coating of chamber components for semiconductor processing
LAM RES CORP8 citations83
US11761079B2Sep 19, 2023
Oxidation resistant protective layer in chamber conditioning
LAM RES CORP5 citations73
US12227837B2Feb 18, 2025
Ex situ coating of chamber components for semiconductor processing
LAM RES CORP2 citations72
US12163219B2Dec 10, 2024
Ex situ coating of chamber components for semiconductor processing
LAM RES CORP0 citations60