P

Inventor

SINHA KOUSTAV

US17 patents
⚠️ This page may combine multiple inventors who share the name “SINHA KOUSTAV”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

16 patents
US11348875B2May 31, 2022

Semiconductor devices with flexible connector array

MICRON TECHNOLOGY INC2 citations71
US11276659B2Mar 15, 2022

Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements

MICRON TECHNOLOGY INC4 citations71
US12543572B2Feb 3, 2026

Semiconductor systems with anti-warpage mechanisms and associated systems, devices, and methods

MICRON TECHNOLOGY INC1 citations63
US12211814B2Jan 28, 2025

Semiconductor interconnect structures with conductive elements, and associated systems and methods

MICRON TECHNOLOGY INC0 citations62
US11728307B2Aug 15, 2023

Semiconductor interconnect structures with conductive elements, and associated systems and methods

MICRON TECHNOLOGY INC0 citations62
US12218079B2Feb 4, 2025

Semiconductor devices with reinforced substrates

MICRON TECHNOLOGY INC0 citations61
US12211822B2Jan 28, 2025

Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods

MICRON TECHNOLOGY INC0 citations61
US11908803B2Feb 20, 2024

Semiconductor devices with flexible connector array

MICRON TECHNOLOGY INC0 citations61
US11869862B2Jan 9, 2024

Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems

MICRON TECHNOLOGY INC0 citations61
US11769752B2Sep 26, 2023

Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods

MICRON TECHNOLOGY INC0 citations61
US11552029B2Jan 10, 2023

Semiconductor devices with reinforced substrates

MICRON TECHNOLOGY INC0 citations61
US11207744B2Dec 28, 2021

Two-step solder-mask-defined design

MICRON TECHNOLOGY INC0 citations61
US12588147B2Mar 24, 2026

Filling cracks on a substrate via

MICRON TECHNOLOGY INC0 citations51
US12341110B2Jun 24, 2025

Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices

MICRON TECHNOLOGY INC0 citations51
US11664360B2May 30, 2023

Circuit board with spaces for embedding components

MICRON TECHNOLOGY INC0 citations51
US11646286B2May 9, 2023

Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints

MICRON TECHNOLOGY INC0 citations51

LODESTAR LICENSING GROUP LLC

1 patent