Inventor
GLANCEY CHRISTOPHER
US17 patents
Patents
17 patentsUS11276659B2Mar 15, 2022
Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements
MICRON TECHNOLOGY INC4 citations71
US12543572B2Feb 3, 2026
Semiconductor systems with anti-warpage mechanisms and associated systems, devices, and methods
MICRON TECHNOLOGY INC1 citations63
US12211814B2Jan 28, 2025
Semiconductor interconnect structures with conductive elements, and associated systems and methods
MICRON TECHNOLOGY INC0 citations62
US11728307B2Aug 15, 2023
Semiconductor interconnect structures with conductive elements, and associated systems and methods
MICRON TECHNOLOGY INC0 citations62
US12218079B2Feb 4, 2025
Semiconductor devices with reinforced substrates
MICRON TECHNOLOGY INC0 citations61
US12211822B2Jan 28, 2025
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
MICRON TECHNOLOGY INC0 citations61
US11869862B2Jan 9, 2024
Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems
MICRON TECHNOLOGY INC0 citations61
US11855002B2Dec 26, 2023
Warpage control in microelectronic packages, and related assemblies and methods
MICRON TECHNOLOGY INC0 citations61
US11769752B2Sep 26, 2023
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
MICRON TECHNOLOGY INC0 citations61
US11552029B2Jan 10, 2023
Semiconductor devices with reinforced substrates
MICRON TECHNOLOGY INC0 citations61
US11031353B2Jun 8, 2021
Warpage control in microelectronic packages, and related assemblies and methods
MICRON TECHNOLOGY INC0 citations61
US12532775B2Jan 20, 2026
Methods and assemblies for measurement and prediction of package and die strength
MICRON TECHNOLOGY INC0 citations60
US12543261B2Feb 3, 2026
Solder mask fault fiber optics sensor
MICRON TECHNOLOGY INC0 citations52
US12588147B2Mar 24, 2026
Filling cracks on a substrate via
MICRON TECHNOLOGY INC0 citations51
US12341110B2Jun 24, 2025
Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices
MICRON TECHNOLOGY INC0 citations51
US11664360B2May 30, 2023
Circuit board with spaces for embedding components
MICRON TECHNOLOGY INC0 citations51
US11646286B2May 9, 2023
Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints
MICRON TECHNOLOGY INC0 citations51