Inventor
HOSHINO SATOHIKO
JP12 patents
⚠️ This page may combine multiple inventors who share the name “HOSHINO SATOHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
8 patentsUS8372739B2Feb 12, 2013
Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication
TOKYO ELECTRON LTD8 citations80
US12125818B2Oct 22, 2024
Technologies for plasma oxidation protection during hybrid bonding of semiconductor devices
TOKYO ELECTRON LTD0 citations55
US7569497B2Aug 4, 2009
Method and apparatus for forming insulating layer
TOKYO ELECTRON LTD0 citations51
US12577665B2Mar 17, 2026
Next generation bonding layer for 3D heterogeneous integration
TOKYO ELECTRON LTD0 citations48
US6890848B2May 10, 2005
Fabrication process of a semiconductor device
TOKYO ELECTRON LTD0 citations46
US12582017B2Mar 17, 2026
Bonding layer and process
TOKYO ELECTRON LTD0 citations41
US7645481B2Jan 12, 2010
Fabrication of low dielectric constant insulating film
TOKYO ELECTRON LTD0 citations40
US10553455B2Feb 4, 2020
Method for aligning chip components relative to substrate by using liquid
TOKYO ELECTRON LTD0 citations39