Inventor
MIMURA YUJI
JP13 patents
Patents
13 patentsUS10340248B2Jul 2, 2019
Bonding systems
TOKYO ELECTRON LTD4 citations71
US9741595B2Aug 22, 2017
Bonding method, storage medium, bonding apparatus and bonding system
TOKYO ELECTRON LTD6 citations68
US9401291B2Jul 26, 2016
Coating apparatus
TOKYO ELECTRON LTD6 citations65
US11626302B2Apr 11, 2023
Bonding method for cleaning non-bonding surface of substrate
TOKYO ELECTRON LTD0 citations62
US11424142B2Aug 23, 2022
Bonding system with cleaning apparatus for cleaning non-bonding surface of substrate
TOKYO ELECTRON LTD1 citations62
US12157293B2Dec 3, 2024
Separating method, separating apparatus, and separating system
TOKYO ELECTRON LTD0 citations59
US11315789B2Apr 26, 2022
Method and structure for low density silicon oxide for fusion bonding and debonding
TOKYO ELECTRON LTD0 citations58
US12451374B2Oct 21, 2025
Bonding system and inspection method of inspecting combined substrate
TOKYO ELECTRON LTD0 citations55
US12394749B2Aug 19, 2025
Bonding system and surface modification method
TOKYO ELECTRON LTD0 citations51
US12469685B2Nov 11, 2025
Surface modifying apparatus and bonding strength determination method
TOKYO ELECTRON LTD0 citations50
US12480884B2Nov 25, 2025
Analysis apparatus, bonding system, and analysis method
TOKYO ELECTRON LTD0 citations49
US11791182B2Oct 17, 2023
Measuring method and measuring device
TOKYO ELECTRON LTD0 citations43
US12582017B2Mar 17, 2026
Bonding layer and process
TOKYO ELECTRON LTD0 citations41