Inventor
SCHNEIDER MARK R
29 patents
⚠️ This page may combine multiple inventors who share the name “SCHNEIDER MARK R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
17 patentsUS5888847AMar 30, 1999
Technique for mounting a semiconductor die
LSI LOGIC CORP158 citations99
US5780928AJul 14, 1998
Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices
LSI LOGIC CORP105 citations98
US5729894AMar 24, 1998
Method of assembling ball bump grid array semiconductor packages
LSI LOGIC CORP230 citations98
US5172301ADec 15, 1992
Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
LSI LOGIC CORP120 citations98
US5610442AMar 11, 1997
Semiconductor device package fabrication method and apparatus
LSI LOGIC CORP100 citations97
US5639696AJun 17, 1997
Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array
LSI LOGIC CORP85 citations96
US5514327AMay 7, 1996
Powder metal heat sink for integrated circuit devices
LSI LOGIC CORP26 citations92
US5051813ASep 24, 1991
Plastic-packaged semiconductor device having lead support and alignment structure
LSI LOGIC CORP31 citations92
US5963795AOct 5, 1999
Method of assembling a heat sink assembly
LSI LOGIC CORP18 citations91
US5789813AAug 4, 1998
Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom
LSI LOGIC CORP31 citations91
US5693981ADec 2, 1997
Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system
LSI LOGIC CORP22 citations91
US5773886AJun 30, 1998
System having stackable heat sink structures
LSI LOGIC CORP50 citations89
US5504374AApr 2, 1996
Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material
LSI LOGIC CORP27 citations86
US5869778AFeb 9, 1999
Powder metal heat sink for integrated circuit devices
LSI LOGIC CORP7 citations74
US5552634ASep 3, 1996
Method and apparatus for dissipating heat in an electronic device
LSI LOGIC CORP18 citations74
US5104827AApr 14, 1992
Method of making a plastic-packaged semiconductor device having lead support and alignment structure
LSI LOGIC CORP8 citations73
US5885848AMar 23, 1999
Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom
LSI LOGIC CORP7 citations72
FAIRCHILD CAMERA INSTR CO
4 patentsUS4077200AMar 7, 1978
Case for an electronic wristwatch module
FAIRCHILD CAMERA INSTR CO96 citations96
US4229936AOct 28, 1980
Low-cost watch case and band
FAIRCHILD CAMERA INSTR CO50 citations90
US4167850ASep 18, 1979
Electronic watch apparatus
FAIRCHILD CAMERA INSTR CO26 citations82
US4182020AJan 8, 1980
Method of manufacturing a battery cover for placement in an opening in a battery container
FAIRCHILD CAMERA INSTR CO10 citations66
ASCENSION TECH CORP
3 patentsUS7373271B1May 13, 2008
System and method for measuring position and orientation using distortion-compensated magnetic fields
ASCENSION TECH CORP187 citations99
US7835785B2Nov 16, 2010
DC magnetic-based position and orientation monitoring system for tracking medical instruments
ASCENSION TECH CORP121 citations96
US7788060B2Aug 31, 2010
System and method for measuring position and orientation using distortion-compensated magnetic fields
ASCENSION TECH CORP46 citations96