Inventor
KIM HOKI
US29 patents
⚠️ This page may combine multiple inventors who share the name “KIM HOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS7714326B2May 11, 2010
Electrical antifuse with integrated sensor
IBM47 citations94
US7145829B1Dec 5, 2006
Single cycle refresh of multi-port dynamic random access memory (DRAM)
IBM35 citations92
US7046565B1May 16, 2006
Bi-mode sense amplifier with dual utilization of the reference cells and dual precharge scheme for improving data retention
IBM24 citations92
US6990025B2Jan 24, 2006
Multi-port memory architecture
IBM31 citations90
US7885138B2Feb 8, 2011
Three dimensional twisted bitline architecture for multi-port memory
IBM7 citations84
US7440353B2Oct 21, 2008
Floating body control in SOI DRAM
IBM13 citations84
US7286437B2Oct 23, 2007
Three dimensional twisted bitline architecture for multi-port memory
IBM11 citations84
US6950353B1Sep 27, 2005
Cell data margin test with dummy cell
IBM17 citations84
US6768143B1Jul 27, 2004
Structure and method of making three finger folded field effect transistors having shared junctions
IBM14 citations84
US6954387B2Oct 11, 2005
Dynamic random access memory with smart refresh scheduler
IBM18 citations83
US7136317B1Nov 14, 2006
DRAM with self-resetting data path for reduced power consumption
IBM8 citations74
US6947348B2Sep 20, 2005
Gain cell memory having read cycle interlock
IBM9 citations74
US7046572B2May 16, 2006
Low power manager for standby operation of memory system
IBM10 citations73
US7023758B2Apr 4, 2006
Low power manager for standby operation of a memory system
IBM5 citations73
US7668003B2Feb 23, 2010
Dynamic random access memory circuit, design structure and method
IBM4 citations63
US7596038B2Sep 29, 2009
Floating body control in SOI DRAM
IBM3 citations63
US6816397B1Nov 9, 2004
Bi-directional read write data structure and method for memory
IBM5 citations62
INVENSAS CORP
8 patentsUS10354976B2Jul 16, 2019
Dies-on-package devices and methods therefor
INVENSAS CORP6 citations84
US9991233B2Jun 5, 2018
Package-on-package devices with same level WLP components and methods therefor
INVENSAS CORP5 citations84
US9991235B2Jun 5, 2018
Package on-package devices with upper RDL of WLPS and methods therefor
INVENSAS CORP5 citations84
US9972609B2May 15, 2018
Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor
INVENSAS CORP8 citations84
US9728524B1Aug 8, 2017
Enhanced density assembly having microelectronic packages mounted at substantial angle to board
INVENSAS CORP7 citations84
US9985007B2May 29, 2018
Package on-package devices with multiple levels and methods therefor
INVENSAS CORP3 citations73
US9972573B2May 15, 2018
Wafer-level packaged components and methods therefor
INVENSAS CORP3 citations73
US10354945B2Jul 16, 2019
Multi-surface edge pads for vertical mount packages and methods of making package stacks
INVENSAS CORP0 citations41