Inventor
VASILYEVA IRINA
US19 patents
⚠️ This page may combine multiple inventors who share the name “VASILYEVA IRINA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
17 patentsUS5733816AMar 31, 1998
Method for depositing a tungsten layer on silicon
MICRON TECHNOLOGY INC356 citations98
US10249819B2Apr 2, 2019
Methods of forming semiconductor structures including multi-portion liners
MICRON TECHNOLOGY INC13 citations91
US7618874B1Nov 17, 2009
Methods of forming capacitors
MICRON TECHNOLOGY INC8 citations83
US9299663B2Mar 29, 2016
Semiconductor devices and methods for backside photo alignment
MICRON TECHNOLOGY INC10 citations80
US7033642B2Apr 25, 2006
Plasma enhanced chemical vapor deposition method of forming a titanium silicide comprising layer
MICRON TECHNOLOGY INC4 citations74
US6767823B2Jul 27, 2004
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC4 citations74
US6734051B2May 11, 2004
Plasma enhanced chemical vapor deposition methods of forming titanium silicide comprising layers over a plurality of semiconductor substrates
MICRON TECHNOLOGY INC11 citations74
US6586285B1Jul 1, 2003
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC9 citations74
US10665782B2May 26, 2020
Methods of forming semiconductor structures including multi-portion liners
MICRON TECHNOLOGY INC2 citations71
US9741612B2Aug 22, 2017
Semiconductor devices and methods for backside photo alignment
MICRON TECHNOLOGY INC2 citations69
US7393563B2Jul 1, 2008
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC1 citations63
US12237217B2Feb 25, 2025
Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US11050020B2Jun 29, 2021
Methods of forming devices including multi-portion liners
MICRON TECHNOLOGY INC0 citations61
US7396570B2Jul 8, 2008
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC0 citations52
US6730355B2May 4, 2004
Chemical vapor deposition method of forming a material over at least two substrates
MICRON TECHNOLOGY INC0 citations52
US10879462B2Dec 29, 2020
Devices including multi-portion liners
MICRON TECHNOLOGY INC0 citations51
US10658580B2May 19, 2020
Semiconductor structures including multi-portion liners
MICRON TECHNOLOGY INC0 citations51