Inventor

DERRAA AMMAR

US64 patents

Patents

50 patents

US6888252B2May 3, 2005

Method of forming a conductive contact

MICRON TECHNOLOGY INC17 citations93

US6657376B1Dec 2, 2003

Electron emission devices and field emission display devices having buffer layer of microcrystalline silicon

MICRON TECHNOLOGY INC21 citations93

US6124665ASep 26, 2000

Row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC18 citations93

US6008063ADec 28, 1999

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC20 citations93

US7402512B2Jul 22, 2008

Matrix-addressable display with minimum column-row overlap and maximum metal line-width

MICRON TECHNOLOGY INC14 citations84

US6908849B2Jun 21, 2005

High aspect ratio contact structure with reduced silicon consumption

MICRON TECHNOLOGY INC13 citations83

US6133057AOct 17, 2000

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

MICRON TECHNOLOGY INC10 citations82

US6059625AMay 9, 2000

Method of fabricating field emission arrays employing a hard mask to define column lines

MICRON TECHNOLOGY INC11 citations82

US6017772AJan 25, 2000

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

MICRON TECHNOLOGY INC15 citations82

US7033642B2Apr 25, 2006

Plasma enhanced chemical vapor deposition method of forming a titanium silicide comprising layer

MICRON TECHNOLOGY INC4 citations74

US6767823B2Jul 27, 2004

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers

MICRON TECHNOLOGY INC4 citations74

US6734051B2May 11, 2004

Plasma enhanced chemical vapor deposition methods of forming titanium silicide comprising layers over a plurality of semiconductor substrates

MICRON TECHNOLOGY INC11 citations74

US6713313B2Mar 30, 2004

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

MICRON TECHNOLOGY INC3 citations74

US6650043B1Nov 18, 2003

Multilayer conductor structure for use in field emission display

MICRON TECHNOLOGY INC8 citations74

US6586285B1Jul 1, 2003

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers

MICRON TECHNOLOGY INC9 citations74

US6579140B2Jun 17, 2003

Method of fabricating row lines of a field emission array and forming pixel openings therethrough by employing two masks

MICRON TECHNOLOGY INC6 citations74

US6559581B2May 6, 2003

Field emission arrays and row lines thereof

MICRON TECHNOLOGY INC6 citations74

US6552478B2Apr 22, 2003

Field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

MICRON TECHNOLOGY INC5 citations74

US6443788B2Sep 3, 2002

Method of fabricating row lines of a field emission array and forming pixel openings therethrough by employing two masks

MICRON TECHNOLOGY INC8 citations74

US6398609B2Jun 4, 2002

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

MICRON TECHNOLOGY INC3 citations74

US6387718B2May 14, 2002

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

MICRON TECHNOLOGY INC3 citations74

US6369497B1Apr 9, 2002

Method of fabricating row lines of a field emission array and forming pixel openings therethrough by employing two masks

MICRON TECHNOLOGY INC8 citations74

US6329744B1Dec 11, 2001

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

MICRON TECHNOLOGY INC7 citations74

US6326222B2Dec 4, 2001

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

MICRON TECHNOLOGY INC4 citations74

US6276982B1Aug 21, 2001

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

MICRON TECHNOLOGY INC5 citations74

US6210985B1Apr 3, 2001

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

MICRON TECHNOLOGY INC3 citations74

US6197607B1Mar 6, 2001

Method of fabricating field emission arrays to optimize the size of grid openings and to minimize the occurrence of electrical shorts

MICRON TECHNOLOGY INC9 citations74

US6121722ASep 19, 2000

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC6 citations74

US6858904B2Feb 22, 2005

High aspect ratio contact structure with reduced silicon consumption

MICRON TECHNOLOGY INC10 citations73

US7393563B2Jul 1, 2008

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers

MICRON TECHNOLOGY INC1 citations63

US7354329B2Apr 8, 2008

Method of forming a monolithic base plate for a field emission display (FED) device

MICRON TECHNOLOGY INC3 citations63

US7091513B1Aug 15, 2006

Cathode assemblies

MICRON TECHNOLOGY INC2 citations63

US6875626B2Apr 5, 2005

Field emission arrays and method of fabricating same to optimize the size of grid openings and to minimize the occurrence of electrical shorts

MICRON TECHNOLOGY INC2 citations63

US6831398B2Dec 14, 2004

Field emission arrays and row lines thereof

MICRON TECHNOLOGY INC2 citations63

US6790114B2Sep 14, 2004

Methods of forming field emitter display (FED) assemblies

MICRON TECHNOLOGY INC2 citations63

US6612891B2Sep 2, 2003

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

MICRON TECHNOLOGY INC1 citations63

US6548947B2Apr 15, 2003

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC1 citations63

US6498425B1Dec 24, 2002

Field emission array with planarized lower dielectric layer

MICRON TECHNOLOGY INC2 citations63

US6406927B2Jun 18, 2002

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC2 citations63

US6383828B2May 7, 2002

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC2 citations63

US6271623B1Aug 7, 2001

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC2 citations63

US6235545B1May 22, 2001

Methods of treating regions of substantially upright silicon-comprising structures, method of treating silicon-comprising emitter structures, methods of forming field emission display devices, and cathode assemblies

MICRON TECHNOLOGY INC4 citations63

US6204077B1Mar 20, 2001

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

MICRON TECHNOLOGY INC2 citations63

US6791149B2Sep 14, 2004

Diffusion barrier layer for semiconductor wafer fabrication

MICRON TECHNOLOGY INC2 citations62

US7518302B2Apr 14, 2009

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

MICRON TECHNOLOGY INC0 citations52

US7396570B2Jul 8, 2008

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers

MICRON TECHNOLOGY INC0 citations52

Showing the top 50 of 64 patents by PatentIndex Score.

DERRAA AMMAR

Patents

Method of forming a conductive contact

Electron emission devices and field emission display devices having buffer layer of microcrystalline silicon

Row lines of a field emission array and forming pixel openings therethrough

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

High aspect ratio contact structure with reduced silicon consumption

Diffusion barrier layer for semiconductor wafer fabrication

Titanium boronitride layer for high aspect ratio semiconductor devices

Method of forming resistor with adhesion layer for electron emission device

Matrix-addressable display with minimum column-row overlap and maximum metal line-width

High aspect ratio contact structure with reduced silicon consumption

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

Method of fabricating field emission arrays employing a hard mask to define column lines

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

Plasma enhanced chemical vapor deposition method of forming a titanium silicide comprising layer

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers

Plasma enhanced chemical vapor deposition methods of forming titanium silicide comprising layers over a plurality of semiconductor substrates

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

Multilayer conductor structure for use in field emission display

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers

Method of fabricating row lines of a field emission array and forming pixel openings therethrough by employing two masks

Field emission arrays and row lines thereof

Field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

Method of fabricating row lines of a field emission array and forming pixel openings therethrough by employing two masks

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

Method of fabricating row lines of a field emission array and forming pixel openings therethrough by employing two masks

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask

Method of fabricating field emission arrays to optimize the size of grid openings and to minimize the occurrence of electrical shorts

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

High aspect ratio contact structure with reduced silicon consumption

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers

Method of forming a monolithic base plate for a field emission display (FED) device

Cathode assemblies

Field emission arrays and method of fabricating same to optimize the size of grid openings and to minimize the occurrence of electrical shorts

Field emission arrays and row lines thereof

Methods of forming field emitter display (FED) assemblies

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

Field emission array with planarized lower dielectric layer

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

Methods of treating regions of substantially upright silicon-comprising structures, method of treating silicon-comprising emitter structures, methods of forming field emission display devices, and cathode assemblies

Method of fabricating row lines of a field emission array and forming pixel openings therethrough

Diffusion barrier layer for semiconductor wafer fabrication

Method of fabricating field emission arrays employing a hard mask to define column lines and another mask to define emitter tips and resistors

Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers