Inventor
CAMPBELL PHILIP H
US32 patents
Patents
32 patentsUS6461436B1Oct 8, 2002
Apparatus and process of improving atomic layer deposition chamber performance
MICRON TECHNOLOGY INC579 citations98
US6845734B2Jan 25, 2005
Deposition apparatuses configured for utilizing phased microwave radiation
MICRON TECHNOLOGY INC59 citations96
US6814813B2Nov 9, 2004
Chemical vapor deposition apparatus
MICRON TECHNOLOGY INC45 citations96
US6677250B2Jan 13, 2004
CVD apparatuses and methods of forming a layer over a semiconductor substrate
MICRON TECHNOLOGY INC56 citations96
US6412437B1Jul 2, 2002
Plasma enhanced chemical vapor deposition reactor and plasma enhanced chemical vapor deposition process
MICRON TECHNOLOGY INC54 citations96
US7311947B2Dec 25, 2007
Laser assisted material deposition
MICRON TECHNOLOGY INC19 citations93
US7185601B2Mar 6, 2007
Chemically sensitive warning apparatus and method
MICRON TECHNOLOGY INC27 citations93
US6858264B2Feb 22, 2005
Chemical vapor deposition methods
MICRON TECHNOLOGY INC28 citations93
US6620253B1Sep 16, 2003
Engagement mechanism for semiconductor substrate deposition process kit hardware
MICRON TECHNOLOGY INC20 citations93
US6613587B1Sep 2, 2003
Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
MICRON TECHNOLOGY INC33 citations93
US6468925B2Oct 22, 2002
Plasma enhanced chemical vapor deposition process
MICRON TECHNOLOGY INC44 citations93
US7229666B2Jun 12, 2007
Chemical vapor deposition method
MICRON TECHNOLOGY INC34 citations92
US7044997B2May 16, 2006
Process byproduct trap, methods of use, and system including same
MICRON TECHNOLOGY INC16 citations92
US6758911B2Jul 6, 2004
Apparatus and process of improving atomic layer deposition chamber performance
MICRON TECHNOLOGY INC32 citations92
US6716284B2Apr 6, 2004
Apparatus and process of improving atomic layer deposition chamber performance
MICRON TECHNOLOGY INC24 citations92
US6800172B2Oct 5, 2004
Interfacial structure for semiconductor substrate processing chambers and substrate transfer chambers and for semiconductor substrate processing chambers and accessory attachments, and semiconductor substrate processor
MICRON TECHNOLOGY INC30 citations91
US7468104B2Dec 23, 2008
Chemical vapor deposition apparatus and deposition method
MICRON TECHNOLOGY INC15 citations83
US7422986B2Sep 9, 2008
Deposition methods utilizing microwave excitation
MICRON TECHNOLOGY INC5 citations74
US7270715B2Sep 18, 2007
Chemical vapor deposition apparatus
MICRON TECHNOLOGY INC9 citations74
US7234412B2Jun 26, 2007
Semiconductor substrate deposition processor chamber liner apparatus
MICRON TECHNOLOGY INC9 citations74
US7033642B2Apr 25, 2006
Plasma enhanced chemical vapor deposition method of forming a titanium silicide comprising layer
MICRON TECHNOLOGY INC4 citations74
US6787373B2Sep 7, 2004
Method of replacing at least a portion of semiconductor substrate deposition process kit hardware, and method of depositing materials over a plurality of semiconductor substrates
MICRON TECHNOLOGY INC7 citations74
US6767823B2Jul 27, 2004
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC4 citations74
US6734051B2May 11, 2004
Plasma enhanced chemical vapor deposition methods of forming titanium silicide comprising layers over a plurality of semiconductor substrates
MICRON TECHNOLOGY INC11 citations74
US6586285B1Jul 1, 2003
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC9 citations74
US7393563B2Jul 1, 2008
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC1 citations63
US7329292B2Feb 12, 2008
Process byproduct trap and system including same
MICRON TECHNOLOGY INC3 citations63
US7105208B2Sep 12, 2006
Methods and processes utilizing microwave excitation
MICRON TECHNOLOGY INC2 citations63
US6849133B2Feb 1, 2005
CVD apparatuses and methods of forming a layer over a semiconductor substrate
MICRON TECHNOLOGY INC4 citations62
US7192487B2Mar 20, 2007
Semiconductor substrate processing chamber and accessory attachment interfacial structure
MICRON TECHNOLOGY INC3 citations61
US7396570B2Jul 8, 2008
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers
MICRON TECHNOLOGY INC0 citations52
US6730355B2May 4, 2004
Chemical vapor deposition method of forming a material over at least two substrates
MICRON TECHNOLOGY INC0 citations52