Inventor
PASCO ROBERT W
US21 patents
⚠️ This page may combine multiple inventors who share the name “PASCO ROBERT W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS6459039B1Oct 1, 2002
Method and apparatus to manufacture an electronic package with direct wiring pattern
IBM125 citations98
US5084071AJan 28, 1992
Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
IBM253 citations98
US4954142ASep 4, 1990
Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
IBM330 citations98
US6319829B1Nov 20, 2001
Enhanced interconnection to ceramic substrates
IBM79 citations96
US6509687B1Jan 21, 2003
Metal/dielectric laminate with electrodes and process thereof
IBM21 citations93
US6726984B2Apr 27, 2004
Ceramic structure using a support sheet
IBM21 citations92
US6607780B1Aug 19, 2003
Process of forming a ceramic structure using a support sheet
IBM21 citations92
US6332782B1Dec 25, 2001
Spatial transformation interposer for electronic packaging
IBM53 citations92
US5226636AJul 13, 1993
Holding fixture for substrates
IBM34 citations90
US5788808AAug 4, 1998
Apparatus for forming cavity substrates using compressive pads
IBM18 citations84
US5315749AMay 31, 1994
Method for holding substrates
IBM15 citations79
US6319554B1Nov 20, 2001
Method and apparatus for surface metallization
IBM8 citations74
US5882455AMar 16, 1999
Apparatus and method for forming isotropic multilayer ceramic substrates
IBM12 citations74
US5759320AJun 2, 1998
Method of forming cavity substrates using compressive pads
IBM12 citations73
US6562169B2May 13, 2003
Multi-level web structure in use for thin sheet processing
IBM8 citations69
US6745932B2Jun 8, 2004
Low strain chip removal apparatus
IBM2 citations63
US6395337B1May 28, 2002
Substrate with ceramic coating for camber modification and method for making
IBM6 citations63
US6423174B1Jul 23, 2002
Apparatus and insertless method for forming cavity substrates using coated membrane
IBM6 citations62