Inventor
CHEN CHANG-FU
TW15 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHANG-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
8 patentsUS10978401B2Apr 13, 2021
Package structure
UNIMICRON TECHNOLOGY CORP3 citations70
US9559045B2Jan 31, 2017
Package structure and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP2 citations67
US7964106B2Jun 21, 2011
Method for fabricating a packaging substrate
UNIMICRON TECHNOLOGY CORP3 citations61
US11476199B2Oct 18, 2022
Package structure
UNIMICRON TECHNOLOGY CORP0 citations59
US11153963B2Oct 19, 2021
Circuit carrier structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations58
US9775246B2Sep 26, 2017
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations42
US10383226B2Aug 13, 2019
Multi-layer circuit structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations41
US10825599B2Nov 3, 2020
Carrier structure
UNIMICRON TECHNOLOGY CORP0 citations34
SILICONWARE PRECISION INDUSTRIES CO LTD
4 patentsUS6509636B1Jan 21, 2003
Semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD84 citations96
US6396129B1May 28, 2002
Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD36 citations91
US6437447B1Aug 20, 2002
Dual-sided chip package without a die pad
SILICONWARE PRECISION INDUSTRIES CO LTD33 citations89
US7135642B2Nov 14, 2006
Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations42