Inventor

TANG FU-DI

TW17 patents

⚠️ This page may combine multiple inventors who share the name “TANG FU-DI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANG FU-DI

SILICONWARE PRECISION INDUSTRIES CO LTD

Carrier-free semiconductor package and fabrication method thereof

Encapsulated semiconductor device with flash-proof structure

Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package

Semiconductor package without chip carrier and fabrication method thereof

Semiconductor package with a support structure and fabrication method thereof

Semiconductor package with heat dissipating structure

Method for fabricating carrier-free semiconductor package

Fabrication method of semiconductor package without chip carrier

Fabrication method of semiconductor package having electrical connecting structures

Wire-bonding method and semiconductor package using the same

Carrier-free semiconductor package and fabrication method

Semiconductor package having electrical connecting structures and fabrication method thereof

Method for fabricating quad flat non-leaded semiconductor package

LIN PANG-CHUN

Semiconductor package having electrical connecting structures and fabrication method thereof

TSAI YUEH-YING

Semiconductor package without chip carrier and fabrication method thereof

HUANG CHIEN-PING

Semiconductor package with a support structure and fabrication method thereof

TANG FU-DI

Quad flat non-leaded semiconductor package