Inventor
LI FELIX C
US15 patents
⚠️ This page may combine multiple inventors who share the name “LI FELIX C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
13 patentsUS7564130B1Jul 21, 2009
Power micro surface-mount device package
NAT SEMICONDUCTOR CORP61 citations97
US6872599B1Mar 29, 2005
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP94 citations97
US6781243B1Aug 24, 2004
Leadless leadframe package substitute and stack package
NAT SEMICONDUCTOR CORP67 citations96
US7109587B1Sep 19, 2006
Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices
NAT SEMICONDUCTOR CORP30 citations92
US7023074B2Apr 4, 2006
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP32 citations92
US7005728B1Feb 28, 2006
Lead configuration for inline packages
NAT SEMICONDUCTOR CORP10 citations73
US6956291B1Oct 18, 2005
Apparatus and method for forming solder seals for semiconductor flip chip packages
NAT SEMICONDUCTOR CORP8 citations73
US7812463B2Oct 12, 2010
Packaging integrated circuits for high stress environments
NAT SEMICONDUCTOR CORP2 citations62
US7456503B1Nov 25, 2008
Integrated circuit package
NAT SEMICONDUCTOR CORP4 citations62
US7432583B2Oct 7, 2008
Leadless leadframe package substitute and stack package
NAT SEMICONDUCTOR CORP3 citations62
US7479411B1Jan 20, 2009
Apparatus and method for forming solder seals for semiconductor flip chip packages
NAT SEMICONDUCTOR CORP0 citations51
US7425503B1Sep 16, 2008
Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices
NAT SEMICONDUCTOR CORP1 citations51
US7898088B2Mar 1, 2011
I/O pad structures for integrated circuit devices
NAT SEMICONDUCTOR CORP0 citations41