Inventor
HOEHN KLAUS
DE33 patents
⚠️ This page may combine multiple inventors who share the name “HOEHN KLAUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OSRAM GMBH
13 patentsUS7629621B2Dec 8, 2009
Light-radiating semiconductor component with a luminescence conversion element
OSRAM GMBH94 citations99
US7345317B2Mar 18, 2008
Light-radiating semiconductor component with a luminescene conversion element
OSRAM GMBH82 citations99
US7151283B2Dec 19, 2006
Light-radiating semiconductor component with a luminescence conversion element
OSRAM GMBH73 citations99
US7126162B2Oct 24, 2006
Light-radiating semiconductor component with a luminescence conversion element
OSRAM GMBH156 citations99
US7078732B1Jul 18, 2006
Light-radiating semiconductor component with a luminescence conversion element
OSRAM GMBH221 citations99
US7709852B2May 4, 2010
Wavelength-converting casting composition and light-emitting semiconductor component
OSRAM GMBH26 citations96
US7276736B2Oct 2, 2007
Wavelength-converting casting composition and white light-emitting semiconductor component
OSRAM GMBH31 citations96
US7235189B2Jun 26, 2007
Method of producing a wavelength-converting casting composition
OSRAM GMBH56 citations96
US7436002B2Oct 14, 2008
Surface-mountable radiation-emitting component
OSRAM GMBH41 citations92
US7009008B1Mar 7, 2006
Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities
OSRAM GMBH16 citations92
US7455461B2Nov 25, 2008
Optoelectronic component and method for the production thereof
OSRAM GMBH10 citations83
US7534634B2May 19, 2009
Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source
OSRAM GMBH10 citations82
US7288606B2Oct 30, 2007
Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities
OSRAM GMBH2 citations63
OSRAM OPTO SEMICONDUCTORS GMBH
10 patentsUS6812500B2Nov 2, 2004
Light-radiating semiconductor component with a luminescence conversion element
OSRAM OPTO SEMICONDUCTORS GMBH457 citations99
US6613247B1Sep 2, 2003
Wavelength-converting casting composition and white light-emitting semiconductor component
OSRAM OPTO SEMICONDUCTORS GMBH192 citations99
US6592780B2Jul 15, 2003
Wavelength-converting casting composition and white light-emitting semiconductor component
OSRAM OPTO SEMICONDUCTORS GMBH177 citations99
US6576930B2Jun 10, 2003
Light-radiating semiconductor component with a luminescence conversion element
OSRAM OPTO SEMICONDUCTORS GMBH496 citations99
US6277301B1Aug 21, 2001
Method of producing a wavelength-converting casting composition
OSRAM OPTO SEMICONDUCTORS GMBH193 citations99
US6245259B1Jun 12, 2001
Wavelength-converting casting composition and light-emitting semiconductor component
OSRAM OPTO SEMICONDUCTORS GMBH375 citations99
US7183661B2Feb 27, 2007
Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof
OSRAM OPTO SEMICONDUCTORS GMBH31 citations93
US7098588B2Aug 29, 2006
Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source
OSRAM OPTO SEMICONDUCTORS GMBH33 citations91
US10263164B2Apr 16, 2019
Electronic component including a material comprising epdxysilane-modified polyorganosiloxane
OSRAM OPTO SEMICONDUCTORS GMBH0 citations49
US9224924B2Dec 29, 2015
Optoelectronic component including an adhesive layer and method for producing the same
OSRAM OPTO SEMICONDUCTORS GMBH0 citations48
SIEMENS AG
7 patentsUS6066861AMay 23, 2000
Wavelength-converting casting composition and its use
SIEMENS AG1,279 citations99
US5492981AFeb 20, 1996
Casting resin of epoxyalkylsiloxane, epoxy resin and anhyride
SIEMENS AG27 citations92
US6248854B1Jun 19, 2001
Modified epoxysiloxane condensate, process for producing the same and its use as low-stress casting resins in the electronic and electrotechnical industry
SIEMENS AG13 citations73
US5883214AMar 16, 1999
Process for the preparation of epoxysilanes
SIEMENS AG14 citations73
US6245187B1Jun 12, 2001
Mechanically firm glued connections between surfaces and the method for producing the same
SIEMENS AG13 citations69
US6297344B1Oct 2, 2001
Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range
SIEMENS AG5 citations63
US6207732B1Mar 27, 2001
Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range
SIEMENS AG3 citations61