Inventor
LIN CHIAN-CHI
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIAN-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
12 patentsUS7002805B2Feb 21, 2006
Thermal enhance MCM package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG112 citations98
US7741152B2Jun 22, 2010
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG44 citations92
US7642132B2Jan 5, 2010
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG24 citations92
US7528053B2May 5, 2009
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG31 citations92
US7446404B2Nov 4, 2008
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG18 citations92
US7045391B2May 16, 2006
Multi-chips bumpless assembly package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG53 citations92
US7221041B2May 22, 2007
Multi-chips module package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG13 citations83
US7790505B2Sep 7, 2010
Semiconductor chip package manufacturing method and structure thereof
ADVANCED SEMICONDUCTOR ENG13 citations81
US7223683B2May 29, 2007
Wafer level bumping process
ADVANCED SEMICONDUCTOR ENG9 citations73
US7547575B2Jun 16, 2009
Two-stage die-bonding method for simultaneous die-bonding of multiple dies
ADVANCED SEMICONDUCTOR ENG7 citations71
US7945062B2May 17, 2011
Microelectromechanical microphone packaging system
ADVANCED SEMICONDUCTOR ENG3 citations62
US7581666B2Sep 1, 2009
Wire-bonding method for wire-bonding apparatus
ADVANCED SEMICONDUCTOR ENG1 citations49