Inventor
YEH YING-TSAI
TW4 patents
Patents
4 patentsUS7187067B2Mar 6, 2007
Sensor chip packaging structure
ADVANCED SEMICONDUCTOR ENG34 citations90
US7049689B2May 23, 2006
Chip on glass package
ADVANCED SEMICONDUCTOR ENG6 citations60
US7122757B2Oct 17, 2006
Contact sensor package structure
ADVANCED SEMICONDUCTOR ENG5 citations58
US7432127B2Oct 7, 2008
Chip package and package process thereof
ADVANCED SEMICONDUCTOR ENG0 citations50