Inventor
LU YUNG LI
TW10 patents
Patents
10 patentsUS7589408B2Sep 15, 2009
Stackable semiconductor package
ADVANCED SEMICONDUCTOR ENG59 citations97
US7550832B2Jun 23, 2009
Stackable semiconductor package
ADVANCED SEMICONDUCTOR ENG56 citations97
US7365427B2Apr 29, 2008
Stackable semiconductor package
ADVANCED SEMICONDUCTOR ENG43 citations92
US7187067B2Mar 6, 2007
Sensor chip packaging structure
ADVANCED SEMICONDUCTOR ENG34 citations90
US7122893B2Oct 17, 2006
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG16 citations83
US7547962B2Jun 16, 2009
Chip package with a ring having a buffer groove that surrounds the active region of a chip
ADVANCED SEMICONDUCTOR ENG4 citations62
US7049689B2May 23, 2006
Chip on glass package
ADVANCED SEMICONDUCTOR ENG6 citations60
US7122757B2Oct 17, 2006
Contact sensor package structure
ADVANCED SEMICONDUCTOR ENG5 citations58
US7126221B2Oct 24, 2006
Semiconductor package
ADVANCED SEMICONDUCTOR ENG0 citations51
US7432127B2Oct 7, 2008
Chip package and package process thereof
ADVANCED SEMICONDUCTOR ENG0 citations50