Inventor
HAN DONG-HO
US36 patents
⚠️ This page may combine multiple inventors who share the name “HAN DONG-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
26 patentsUS7110263B2Sep 19, 2006
Reference slots for signal traces
INTEL CORP19 citations92
US6885544B2Apr 26, 2005
Vertical capacitor apparatus, systems, and methods
INTEL CORP25 citations92
US7345359B2Mar 18, 2008
Integrated circuit package with chip-side signal connections
INTEL CORP14 citations84
US11133256B2Sep 28, 2021
Embedded bridge substrate having an integral device
INTEL CORP12 citations83
US7142073B2Nov 28, 2006
Transmission line impedance matching
INTEL CORP10 citations74
US10454163B2Oct 22, 2019
Ground layer design in a printed circuit board (PCB)
INTEL CORP6 citations73
US6877998B1Apr 12, 2005
Power and ground connectors for socket
INTEL CORP11 citations73
US12074368B2Aug 27, 2024
Electronic computing device having self-shielding antenna
INTEL CORP2 citations72
US11558158B2Jan 17, 2023
Methods and devices for dynamically avoiding radio frequency interference
INTEL CORP2 citations69
US7611924B2Nov 3, 2009
Integrated circuit package with chip-side signal connections
INTEL CORP4 citations63
US7432779B2Oct 7, 2008
Transmission line impedance matching
INTEL CORP4 citations63
US7352557B2Apr 1, 2008
Vertical capacitor apparatus, systems, and methods
INTEL CORP2 citations63
US7218183B2May 15, 2007
Transmission line impedance matching
INTEL CORP4 citations63
US10950555B2Mar 16, 2021
Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator
INTEL CORP0 citations62
US12555917B2Feb 17, 2026
Radio frequency interference (RFI) shielded substrate-integrated-waveguide (SIW) cavity antenna
INTEL CORP0 citations61
US11616000B2Mar 28, 2023
Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material
INTEL CORP1 citations61
US11081450B2Aug 3, 2021
Radiation shield around a component on a substrate
INTEL CORP1 citations61
US11749606B2Sep 5, 2023
Embedded bridge substrate having an integral device
INTEL CORP0 citations59
US12526969B2Jan 13, 2026
High speed grid array module
INTEL CORP0 citations57
US11295998B2Apr 5, 2022
Stiffener and package substrate for a semiconductor package
INTEL CORP0 citations54
US10991665B2Apr 27, 2021
Package-level noise filtering for EMI RFI mitigation
INTEL CORP0 citations54
US12133322B2Oct 29, 2024
Electromagnetic interference shields having attentuation interfaces
INTEL CORP0 citations51
US10403581B2Sep 3, 2019
Electronic device packages with attenuated electromagnetic interference signals
INTEL CORP0 citations51
US12556216B2Feb 17, 2026
Distributed radiohead system
INTEL CORP0 citations49
US10645797B2May 5, 2020
Electromagnetic interference (EMI) shield for a printed circuit board (PCB)
INTEL CORP0 citations48
US12488731B2Dec 2, 2025
Display timing controller and method
INTEL CORP0 citations41
HSU HAO-HAN
3 patentsUS9705182B2Jul 11, 2017
Patch-based proximity sensors, antennas, and control systems to control antennas based on corresponding proximity measures
HSU HAO-HAN4 citations70
US8907859B2Dec 9, 2014
Edge-emitting antennas for ultra slim wireless mobile devices
HSU HAO-HAN2 citations59
US9251984B2Feb 2, 2016
Hybrid radio frequency component
HSU HAO-HAN0 citations39