Inventor
BEATSON DAVID T
US28 patents
⚠️ This page may combine multiple inventors who share the name “BEATSON DAVID T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KULICKE & SOFFA INVESTMENTS
14 patentsUS6903880B2Jun 7, 2005
Method for providing plural magnified images
KULICKE & SOFFA INVESTMENTS22 citations92
US6608390B2Aug 19, 2003
Wirebonded semiconductor package structure and method of manufacture
KULICKE & SOFFA INVESTMENTS13 citations81
US6412683B1Jul 2, 2002
Cornercube offset tool
KULICKE & SOFFA INVESTMENTS13 citations81
US6599561B2Jul 29, 2003
Method for manufacturing a printed circuit board substrate
KULICKE & SOFFA INVESTMENTS19 citations74
US6870684B2Mar 22, 2005
Multi-wavelength aperture and vision system and method using same
KULICKE & SOFFA INVESTMENTS4 citations62
US6712257B2Mar 30, 2004
Indirect imaging method for a bonding tool
KULICKE & SOFFA INVESTMENTS1 citations62
US6641026B2Nov 4, 2003
Indirect imaging system for a bonding tool
KULICKE & SOFFA INVESTMENTS1 citations62
US6529333B1Mar 4, 2003
Multi-color machine vision system
KULICKE & SOFFA INVESTMENTS2 citations61
US6997368B2Feb 14, 2006
Fiber alignment process using cornercube offset tool
KULICKE & SOFFA INVESTMENTS3 citations59
US6960022B2Nov 1, 2005
Macrocomposite guideway and gib produced therefrom
KULICKE & SOFFA INVESTMENTS5 citations55
US6760161B2Jul 6, 2004
Multi-color machine vision system
KULICKE & SOFFA INVESTMENTS0 citations51
US6729530B2May 4, 2004
Fiber alignment apparatus and process using cornercube offset tool
KULICKE & SOFFA INVESTMENTS1 citations49
US6778274B2Aug 17, 2004
Die attach process using cornercube offset tool
KULICKE & SOFFA INVESTMENTS0 citations48
US6705507B2Mar 16, 2004
Die attach system and process using cornercube offset tool
KULICKE & SOFFA INVESTMENTS1 citations48
KULICKE & SOFFA IND INC
7 patentsUS7294217B2Nov 13, 2007
Electrical interconnect structures for integrated circuits and methods of manufacturing the same
KULICKE & SOFFA IND INC21 citations88
US7160797B2Jan 9, 2007
Method of bumping die pads for wafer testing
KULICKE & SOFFA IND INC11 citations84
US7523848B2Apr 28, 2009
Method and apparatus for measuring the size of free air balls on a wire bonder
KULICKE & SOFFA IND INC9 citations81
US7320423B2Jan 22, 2008
High speed linear and rotary split-axis wire bonder
KULICKE & SOFFA IND INC7 citations73
US7442641B2Oct 28, 2008
Integrated ball and via package and formation process
KULICKE & SOFFA IND INC5 citations61
US7320424B2Jan 22, 2008
Linear split axis wire bonder
KULICKE & SOFFA IND INC2 citations60
US7527186B2May 5, 2009
Method and apparatus for mapping a position of a capillary tool tip using a prism
KULICKE & SOFFA IND INC5 citations59