P

Inventor

LEE MYUNG KIL

KR7 patents
⚠️ This page may combine multiple inventors who share the name “LEE MYUNG KIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

4 patents
US7674640B2Mar 9, 2010

Stacked die package system

STATS CHIPPAC LTD5 citations71
US7279785B2Oct 9, 2007

Stacked die package system

STATS CHIPPAC LTD9 citations71
US7947535B2May 24, 2011

Thin package system with external terminals

STATS CHIPPAC LTD0 citations51
US8026582B2Sep 27, 2011

Integrated circuit package system with internal stacking module adhesive

STATS CHIPPAC LTD1 citations50

BAE HYUNIL

1 patent
US8816487B2Aug 26, 2014

Integrated circuit packaging system with package-in-package and method of manufacture thereof

BAE HYUNIL2 citations56

LEE MYUNG KIL

1 patent
US8089143B2Jan 3, 2012

Integrated circuit package system using interposer

LEE MYUNG KIL5 citations54

KIM YOUNGCHEOL

1 patent
US8481371B2Jul 9, 2013

Thin package system with external terminals and method of manufacture thereof

KIM YOUNGCHEOL0 citations44