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Inventor
JUNG TAEBOK
KR
4 patents
⚠️ This page may combine multiple inventors who share the name “JUNG TAEBOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPPAC INC
2 patents
US7208821B2
Apr 24, 2007
Multichip leadframe package
CHIPPAC INC
19 citations
89
US7436048B2
Oct 14, 2008
Multichip leadframe package
CHIPPAC INC
15 citations
80
STATS CHIPPAC LTD
2 patents
US7674640B2
Mar 9, 2010
Stacked die package system
STATS CHIPPAC LTD
5 citations
71
US7279785B2
Oct 9, 2007
Stacked die package system
STATS CHIPPAC LTD
9 citations
71