Inventor
SUEYOSHI TAKAYUKI
JP5 patents
Patents
5 patentsUS7473458B2Jan 6, 2009
Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
HITACHI CHEMICAL CO LTD11 citations82
US7816430B2Oct 19, 2010
Composition of polycyanate ester and biphenyl epoxy resin
HITACHI CHEMICAL CO LTD3 citations61
US7955689B2Jun 7, 2011
Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
HITACHI CHEMICAL CO LTD2 citations60
US7749612B2Jul 6, 2010
Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
HITACHI CHEMICAL CO LTD1 citations60
US7749605B2Jul 6, 2010
Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
HITACHI CHEMICAL CO LTD1 citations60