Inventor
TSAI WEN-CHING
TW34 patents
⚠️ This page may combine multiple inventors who share the name “TSAI WEN-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AU OPTRONICS CORP
13 patentsUS7902670B2Mar 8, 2011
Display panel structure and manufacture method thereof
AU OPTRONICS CORP8 citations83
US7247911B2Jul 24, 2007
Thin film transistor and manufacturing method thereof
AU OPTRONICS CORP13 citations82
US7786514B2Aug 31, 2010
Switching device for a pixel electrode
AU OPTRONICS CORP5 citations73
US7625788B2Dec 1, 2009
Display element and method of manufacturing the same
AU OPTRONICS CORP6 citations73
US7332383B2Feb 19, 2008
Switching device for a pixel electrode and methods for fabricating the same
AU OPTRONICS CORP8 citations73
US7829393B2Nov 9, 2010
Copper gate electrode of liquid crystal display device and method of fabricating the same
AU OPTRONICS CORP6 citations72
US7417254B2Aug 26, 2008
Switching device for a pixel electrode and methods for fabricating the same
AU OPTRONICS CORP4 citations63
US7528466B2May 5, 2009
Copper gate electrode of liquid crystal display device and method of fabricating the same
AU OPTRONICS CORP2 citations61
US7411212B2Aug 12, 2008
Switching device for a pixel electrode and methods for fabricating the same
AU OPTRONICS CORP4 citations61
US7384831B2Jun 10, 2008
Thin film transistor and manufacturing method thereof
AU OPTRONICS CORP4 citations61
US7888190B2Feb 15, 2011
Switching device for a pixel electrode and methods for fabricating the same
AU OPTRONICS CORP0 citations51
US7875885B2Jan 25, 2011
Display element and method of manufacturing the same
AU OPTRONICS CORP0 citations51
US7598524B2Oct 6, 2009
Thin film transistor with electrode adhesion layers
AU OPTRONICS CORP0 citations50
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS10373885B2Aug 6, 2019
3D stacked-chip package
TAIWAN SEMICONDUCTOR MFG CO LTD49 citations97
US9698081B2Jul 4, 2017
3D chip-on-wafer-on-substrate structure with via last process
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations94
US9666520B2May 30, 2017
3D stacked-chip package
TAIWAN SEMICONDUCTOR MFG CO LTD26 citations93
US10157882B2Dec 18, 2018
3D chip-on-wafer-on-substrate structure with via last process
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9754918B2Sep 5, 2017
3D chip-on-wafer-on-substrate structure with via last process
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9711379B2Jul 18, 2017
3D stacked-chip package
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9633917B2Apr 25, 2017
Three dimensional integrated circuit structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9449837B2Sep 20, 2016
3D chip-on-wafer-on-substrate structure with via last process
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US10535631B2Jan 14, 2020
3D Chip-on-wager-on-substrate structure with via last process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10971417B2Apr 6, 2021
3D stacked-chip package
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US9613926B2Apr 4, 2017
Wafer to wafer bonding process and structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
UNITED MICROELECTRONICS CORP
4 patentsUS5482876AJan 9, 1996
Field effect transistor without spacer mask edge defects
UNITED MICROELECTRONICS CORP22 citations91
US7544992B2Jun 9, 2009
Illuminating efficiency-increasable and light-erasable embedded memory structure
UNITED MICROELECTRONICS CORP13 citations84
US7639536B2Dec 29, 2009
Storage unit of single-conductor non-volatile memory cell and method of erasing the same
UNITED MICROELECTRONICS CORP2 citations62
US7732886B2Jun 8, 2010
Pin photodiode structure
UNITED MICROELECTRONICS CORP6 citations61