Inventor
BROUILLETTE DONALD W
US15 patents
⚠️ This page may combine multiple inventors who share the name “BROUILLETTE DONALD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
14 patentsUS6271102B1Aug 7, 2001
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
IBM125 citations98
US6368881B1Apr 9, 2002
Wafer thickness control during backside grind
IBM54 citations96
US6915795B2Jul 12, 2005
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
IBM20 citations92
US6887126B2May 3, 2005
Wafer thickness control during backside grind
IBM25 citations92
US6153536ANov 28, 2000
Method for mounting wafer frame at back side grinding (BSG) tool
IBM42 citations92
US6171873B1Jan 9, 2001
Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
IBM15 citations89
US5888838AMar 30, 1999
Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
IBM25 citations89
US6888223B2May 3, 2005
Use of photoresist in substrate vias during backside grind
IBM14 citations81
US6600213B2Jul 29, 2003
Semiconductor structure and package including a chip having chamfered edges
IBM7 citations73
US7074715B2Jul 11, 2006
Use of photoresist in substrate vias during backside grind
IBM5 citations60
US7001827B2Feb 21, 2006
Semiconductor wafer front side protection
IBM3 citations57
US7134933B2Nov 14, 2006
Wafer thickness control during backside grind
IBM0 citations52
US7902682B2Mar 8, 2011
Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
IBM1 citations47
US7288465B2Oct 30, 2007
Semiconductor wafer front side protection
IBM1 citations46