Inventor
WHALEN MATTHEW R
US7 patents
⚠️ This page may combine multiple inventors who share the name “WHALEN MATTHEW R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS7387911B2Jun 17, 2008
Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
IBM10 citations80
US7771560B2Aug 10, 2010
Methods to prevent ECC (edge chipping and cracking) damage during die picking process
IBM2 citations61
US7348216B2Mar 25, 2008
Rework process for removing residual UV adhesive from C4 wafer surfaces
IBM3 citations58
US7001827B2Feb 21, 2006
Semiconductor wafer front side protection
IBM3 citations57
US7902682B2Mar 8, 2011
Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
IBM1 citations47
US7288465B2Oct 30, 2007
Semiconductor wafer front side protection
IBM1 citations46