Inventor
CHAPMAN DAVID J
US12 patents
⚠️ This page may combine multiple inventors who share the name “CHAPMAN DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JDS UNIPHASE CORP
3 patentsUS6583388B2Jun 24, 2003
High thermal efficiency, small form-factor packages including thermally insulative cavities, and transfer molded variants
JDS UNIPHASE CORP9 citations73
US6697553B2Feb 24, 2004
Compact, low insertion loss, high yield arrayed waveguide grating
JDS UNIPHASE CORP9 citations70
US6606425B1Aug 12, 2003
Transfer molded packages with embedded thermal insulation
JDS UNIPHASE CORP2 citations62